5.1 POWER8&lt;sup&gt;TM&lt;/sup&gt;: A 12-core server-class processor in 22nm SOI with 7.6Tb/s off-chip bandwidth

Fluhr, Eric; Friedrich, Joshua; Dreps, Daniel; Zyuban, Victor; Still, Gregory; González, Christopher; Hall, A.C.; Hogenmiller, David; Malgioglio, F.; Nett, Ryan; Paredes, Jose; Pille, J.; Plass, D.; Puri, Ruchir; Restle, P.J.; Shan, David; Stawiasz, K.; Deniz, Zeynep; Wendel, D.; Ziegler, Matt

doi:10.1109/isscc.2014.6757353

Cited by 51 publications

(50 citation statements)

References 2 publications

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“…-The third was an IBM ® S822LC compute node equipped with two 10-core 2.92 GHz POWER8 processors (Fluhr et al, 2014;Stuecheli, 2013) with turbo up to 4 GHz. Simultaneous multithreading is set to 4 for optimum performance in HPC applications.…”

Section: Results and Evaluationmentioning

confidence: 99%

GPU-accelerated atmospheric chemical kinetics in the ECHAM/MESSy (EMAC) Earth system model (version 2.52)

Alvanos

Christoudias

2017

Geosci. Model Dev.

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Abstract. This paper presents an application of GPU accelerators in Earth system modeling. We focus on atmospheric chemical kinetics, one of the most computationally intensive tasks in climate-chemistry model simulations. We developed a software package that automatically generates CUDA kernels to numerically integrate atmospheric chemical kinetics in the global climate model ECHAM/MESSy Atmospheric Chemistry (EMAC), used to study climate change and air quality scenarios. A source-to-source compiler outputs a CUDA-compatible kernel by parsing the FORTRAN code generated by the Kinetic PreProcessor (KPP) general analysis tool. All Rosenbrock methods that are available in the KPP numerical library are supported.Performance evaluation, using Fermi and Pascal CUDAenabled GPU accelerators, shows achieved speed-ups of 4.5× and 20.4×, respectively, of the kernel execution time. A node-to-node real-world production performance comparison shows a 1.75× speed-up over the non-accelerated application using the KPP three-stage Rosenbrock solver. We provide a detailed description of the code optimizations used to improve the performance including memory optimizations, control code simplification, and reduction of idle time. The accuracy and correctness of the accelerated implementation are evaluated by comparing to the CPU-only code of the application. The median relative difference is found to be less than 0.000000001 % when comparing the output of the accelerated kernel the CPU-only code.The approach followed, including the computational workload division, and the developed GPU solver code can potentially be used as the basis for hardware acceleration of numerous geoscientific models that rely on KPP for atmospheric chemical kinetics applications.

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Section: Results and Evaluationmentioning

confidence: 99%

GPU-accelerated atmospheric chemical kinetics in the ECHAM/MESSy (EMAC) Earth system model (version 2.52)

Alvanos

Christoudias

2017

Geosci. Model Dev.

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“…Note that the MPU characteristics are similar to the server-class IBM POWER8 microprocessor [18]. The HBM stacks simulated in the present work contain four memory chips of 7 µm height each.…”

Section: D Mpsoc Architecture and Floorplanmentioning

confidence: 99%

PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

Andreev

Sridhar

Sabry

et al. 2018

IEEE Trans. Comput.

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Abstract-Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to address both heat removal and power delivery issues in 3D Multiprocessor Systems-on-Chips (MPSoCs). In this paper we motivate the benefits of FCA in 3D MPSoCs via a qualitative analysis and explore the capabilities of the proposed technology using our extended PowerCool simulator. PowerCool is a tool that performs combined compact thermal and electrochemical simulation of 3D MPSoCs with inter-tier FCA-based cooling and power generation. We validate our electrochemical model against experimental data obtained using a micro-scale FCA, and extend PowerCool with a compact thermal model (3D-ICE) and subthreshold leakage estimation. We show the sensitivity of the FCA cooling and power generation on the design-time (FCA geometry) and run-time (fluid inlet temperature, flow rate) parameters. Our results show that we can optimize the FCA to keep maximum chip temperature below 95°C for an average chip power consumption of 50 W/cm 2 while generating up to 3.6 W per cm 2 of chip area.

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“…For example, IBM's 45-nm Power7 processor had a 32 MB LLC [29]; the 32-nm Power7+ processor had an 80 MB LLC [30]; and the 22-nm Power8 processor had a 96 MB LLC [31]. LLC size in GPUs is also on the rise [32].…”

Section: Motivation Behind the Design Of Destinymentioning

confidence: 99%

DESTINY: A Comprehensive Tool with 3D and Multi-Level Cell Memory Modeling Capability

Mittal

Wang

Vetter

2017

JLPEA

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Abstract:To enable the design of large capacity memory structures, novel memory technologies such as non-volatile memory (NVM) and novel fabrication approaches, e.g., 3D stacking and multi-level cell (MLC) design have been explored. The existing modeling tools, however, cover only a few memory technologies, technology nodes and fabrication approaches. We present DESTINY, a tool for modeling 2D/3D memories designed using SRAM, resistive RAM (ReRAM), spin transfer torque RAM (STT-RAM), phase change RAM (PCM) and embedded DRAM (eDRAM) and 2D memories designed using spin orbit torque RAM (SOT-RAM), domain wall memory (DWM) and Flash memory. In addition to single-level cell (SLC) designs for all of these memories, DESTINY also supports modeling MLC designs for NVMs. We have extensively validated DESTINY against commercial and research prototypes of these memories. DESTINY is very useful for performing design-space exploration across several dimensions, such as optimizing for a target (e.g., latency, area or energy-delay product) for a given memory technology, choosing the suitable memory technology or fabrication method (i.e., 2D v/s 3D) for a given optimization target, etc. We believe that DESTINY will boost studies of next-generation memory architectures used in systems ranging from mobile devices to extreme-scale supercomputers. The latest source-code of DESTINY is available from the following git repository: https://bitbucket.org/sparsh_mittal/destiny_v2.

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5.1 POWER8<sup>TM</sup>: A 12-core server-class processor in 22nm SOI with 7.6Tb/s off-chip bandwidth

Cited by 51 publications

References 2 publications

GPU-accelerated atmospheric chemical kinetics in the ECHAM/MESSy (EMAC) Earth system model (version 2.52)

GPU-accelerated atmospheric chemical kinetics in the ECHAM/MESSy (EMAC) Earth system model (version 2.52)

PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

DESTINY: A Comprehensive Tool with 3D and Multi-Level Cell Memory Modeling Capability

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