2018
DOI: 10.1016/j.matlet.2018.07.020
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3D printing of thermoplastic PI and interlayer bonding evaluation

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Cited by 36 publications
(22 citation statements)
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“…The IPS provides an additional energy source that increases the thermal energy of the polymer surface. The higher temperature of the interlayer contact zone leads to an increased movement of polymer chains and thus to a higher interlayer bonding performance [23]. The quasi-static and cyclic experiments in this study show the same tendency.…”
Section: Fffsupporting
confidence: 72%
“…The IPS provides an additional energy source that increases the thermal energy of the polymer surface. The higher temperature of the interlayer contact zone leads to an increased movement of polymer chains and thus to a higher interlayer bonding performance [23]. The quasi-static and cyclic experiments in this study show the same tendency.…”
Section: Fffsupporting
confidence: 72%
“…The research with TPI (thermoplastic polyimide) material shows that nozzle temperature makes significant change in interlayer bonding. When it was at 335 ∘ C the interlayer bonding force was 334.5 N and if it was adjusted at 340 ∘ C the interlayer bonding force would be 260.5 N. This research suggested that it has to find a suitable temperature for the different materials [21].…”
Section: Introductionmentioning
confidence: 91%
“…For better results in the mechanical strength of FDM printed functional prototypes, some studies have suggested these parameters and levels for preparations of 3D printed parts. 2428…”
Section: Experimentationmentioning
confidence: 99%
“…23,24 Bonding force between layers is effected by the printing temperature. 25 In the case of surface finish and mechanical properties of prototyped parts, role of nozzle conditions are very important. 26,27 Also, it is reported that the direction of printing affects the microstructure and mechanical properties of specimens.…”
Section: Introductionmentioning
confidence: 99%