20.2 A 3.09-to-4.04GHz Distributed-Boosting and Harmonic-Impedance-Expanding Multi-Core Oscillator with-138.9dBc/Hz at 1MHz Offset and 195.1dBc/Hz FoM

Shu, Yiyang; Qian, Huizhen Jenny; Gao, Xiang; Luo, Xun

doi:10.1109/isscc42613.2021.9365737

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“…To overcome the limitation of conventional multi-core oscillator, this article proposes a distributed-swing-boosting and harmonic-impedance-expanding quad-core oscillator [24], which can achieve low phase noise, high FoM, and compact chip size simultaneously. A distributed-coupling multicore topology is introduced to reduce the chip size and determine the current direction of each core without resistor in center taps.…”

Section: Introductionmentioning

A Low Phase Noise and High FoM Distributed-Swing-Boosting Multi-Core Oscillator Using Harmonic-Impedance-Expanding Technique

Shu,

Qian,

Gao

et al. 2021

IEEE J. Solid-State Circuits

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In this article, a distributed-swing-boosting and harmonic-impedance-expanding multi-core oscillator is proposed to achieve low phase noise and high figure-of-merit (FoM), simultaneously. First, a distributed-coupling multi-core topology is introduced to reduce the chip area with no mode ambiguity. Then, the distributed-swing-boosting and harmonic-impedanceexpanding structure is developed to boost the gate swing and square-like waveform of V DS . The common-mode (CM) resonances around the second harmonic and the differential-mode (DM) resonances around the third harmonic are utilized to suppress the flicker noise up-conversion and achieve harmonic shaping. Meanwhile, the dual-resonance response expands the high-impedance frequency ranges around the harmonics, and thus, the effect of harmonic shaping can be obtained over a wide frequency range. Fabricated in a 40-nm CMOS process, the oscillator measured exhibits low phase noise and high FoM simultaneously with a compact chip size. The minimum phase noise is −138.9 dBc/Hz at the 1-MHz offset, corresponding to an FoM of 195.1 dBc/Hz. The 1/ f 3 phase noise corner is 100-130 kHz over the 26.6% tuning range.

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Section: Introductionmentioning

A Low Phase Noise and High FoM Distributed-Swing-Boosting Multi-Core Oscillator Using Harmonic-Impedance-Expanding Technique

Shu,

Qian,

Gao

et al. 2021

IEEE J. Solid-State Circuits

View full text Add to dashboard Buy / Rent full text

show abstract

20.2 A 3.09-to-4.04GHz Distributed-Boosting and Harmonic-Impedance-Expanding Multi-Core Oscillator with-138.9dBc/Hz at 1MHz Offset and 195.1dBc/Hz FoM

A Low Phase Noise and High FoM Distributed-Swing-Boosting Multi-Core Oscillator Using Harmonic-Impedance-Expanding Technique

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A Low Phase Noise and High FoM Distributed-Swing-Boosting Multi-Core Oscillator Using Harmonic-Impedance-Expanding Technique

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