2017
DOI: 10.1002/sdtp.11682
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19‐4: Invited Paper: Emissive Displays with Transfer‐Printed Microscale Inorganic LEDs

Abstract: Major advances in flat panel displays can come from the pixel‐level integration of high performance microscale components fabricated on semiconductor wafers and transferred by advanced assembly methods onto large‐area substrates. Displays that use direct light emission from tiny inorganic light emitting diodes (µILEDs) have the potential to be very bright and power efficient. Transfer‐printing with elastomer stamps is a candidate assembly technology for making µILED displays, serving as the metaphorica… Show more

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Cited by 25 publications
(22 citation statements)
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“…In this process, the micro-components are first transferred to the non-native substrate, followed by metal redistribution layer deposition. In another embodiment involving flip-chip LEDs (as shown in Figure 2(b)), the target display substrate is pre-patterned with metal traces and during the transferprinting process, the electrodes of the microLEDs make electrical interconnection with the display substrate using a pressure activated interconnection process [11,14,15]. The pixel engines, shown in Figure 1, include conductive structures that allow formation of electrical interconnections using the pressureactivated interconnection process [13].…”
Section: Interconnectionsmentioning
confidence: 99%
“…In this process, the micro-components are first transferred to the non-native substrate, followed by metal redistribution layer deposition. In another embodiment involving flip-chip LEDs (as shown in Figure 2(b)), the target display substrate is pre-patterned with metal traces and during the transferprinting process, the electrodes of the microLEDs make electrical interconnection with the display substrate using a pressure activated interconnection process [11,14,15]. The pixel engines, shown in Figure 1, include conductive structures that allow formation of electrical interconnections using the pressureactivated interconnection process [13].…”
Section: Interconnectionsmentioning
confidence: 99%
“…µLED technology will serve as a platform for large area and high performance display application due to its high contrast ratio, fast response time, and low power consumption . Researchers have suggested two strong candidates for realizing full‐color red‐green‐blue (RGB) thin‐film µLED displays: (i) color conversion from blue/UV µLEDs using quantum dots (QDs) and (ii) transfer of red, green, and blue µLEDs in three separate processes . Figure exhibits various demonstrations of µLED displays.…”
Section: Research Applications Of µLedsmentioning
confidence: 99%
“…QD‐based color filters successfully converted the UV light of µLEDs to red, green, and blue light without color mixing. Figure b shows a process schematic of a passive‐matrix inorganic full‐color µLED (PMILED) display using stamping transfer of true RGB µLEDs . Self‐emissive full‐color µLEDs were separately transferred from the mother RGB III–V wafers to a display substrate using a patterned PDMS stamp, and interconnected by metal electrode lines.…”
Section: Research Applications Of µLedsmentioning
confidence: 99%
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“…However, high current driving by TFT circuits must be solved [3]. Therefore, most of the AM driving micro-LED displays adopt complementary metal-oxide semiconductor (CMOS) backplane [4][5][6][7] or a plurality of micro-CMOS ICs transferred onto the displays [8,9].…”
Section: Objective and Backgroundmentioning
confidence: 99%