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“…Thinning of the CMOS substrate will allow this device to be rendered mechanically flexible [44]. In this way, we can envisage the emergence of wearable ultrasound patches for high-precision and non-invasive neuromodulation of peripheral nerves and for powering sub-mm implantable devices for both…”
Section: Discussionmentioning
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“…Thinning of the CMOS substrate will allow this device to be rendered mechanically flexible [44]. In this way, we can envisage the emergence of wearable ultrasound patches for high-precision and non-invasive neuromodulation of peripheral nerves and for powering sub-mm implantable devices for both…”
Section: Discussionmentioning
“…Implants that include CMOS technology, but with the silicon thinned down to where the device becomes flexible and embedded in a polymer substrate to facilitate handling, already exist. They represent an exciting future perspective to achieve flexible and small electrodes without sacrificing electrode integration density (Chiang et al 2020;Moazeni et al 2021).…”
Section: Does the Optimal Probe Exist?mentioning