Aspects of fabrication and characterization of electro-thermal micro-actuators

Godoy, Paulo Henrique de; Silva, Emilío Carlos Nelli

doi:10.1590/s1678-58782007000100005

Cited by 5 publications

(3 citation statements)

References 12 publications

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“…Electrical Resistivity and Thermal Expansion. According to published data in [4], temperaturedependent properties of nickel are affected by its Magnetic phase transition. Throughout all of its properties, electrical resistivity is highly affected by this phenomenon; thus, temperature dependent electrical resistivity for nickel is considered as shown in Table II.…”

Section: Finite Element Analysismentioning

confidence: 99%

“…Thermal expansion coefficient (α) increases with temperature. This increase accompanied by decrease in Young's modulus with temperature rise, will produce almost constant thermal stresses [4]; Hence to assure realistic results of simulations, temperature-dependant thermal expansion coefficients are utilized in models and shown in Table III. Conductive and Convective Heat Transfer Coefficients.…”

Section: Finite Element Analysismentioning

confidence: 99%

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A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components

Vismeh

Salimi

2011

AMR

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In recent years, assembling and packaging methods of Micro Electro Mechanical System (MEMS) components have been profoundly studied. The focus of this paper is presenting a novel alignment technique in wafer-level packaging. In conventional wafer-level strategies, either an Alignment Template (AT) must have special receptor sites according to the microchip geometry and its material, or the microcomponents should be additionally featured by circular and cross pegs for shape recognition stage. In this article, we have developed electrothermal microclamps (ETMCs) to hold and locate six microchips of 360×360×20 micrometers in a microfixturing cell. This is to provide accurate preliminary positioning for final flip-chip bonding process of wafer-level packaging on a main assembly board (MAB). The new approach enjoys the advantages of omitting special AT with receptor sites and using identical ETMCs for diverse assembly configurations. Being applicable for different types of microcomponent materials, it does necessitate no surface treatment on microcomponents such as Semidry uniquely orienting self-organizing parallel assembly (Semi-DUO-SPASS) technique. Comparing nickel and polysilicon as fabrication materials, corresponding values of input voltage to reach 3 micrometers displacement of the ETMC arm are estimated via finite element analysis to ascertain positioning and holding of microchips. Nickel showed to be a better choice for fabrication due to requiring lower input voltage and lower maximum resulting temperature. The simulation results are verified with published experimental measurements.

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Section: Finite Element Analysismentioning

confidence: 99%

Section: Finite Element Analysismentioning

confidence: 99%

A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components

Vismeh

Salimi

2011

AMR

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“…A number of research efforts have been devoted in static modelling [34], design [35,36], and fabrication [37] of the V-shaped beams. e V-shaped beams are demonstrated to be capable of producing large displacement and force.…”

Section: Introductionmentioning

confidence: 99%

Vibration Modes and Parameter Analysis of V‐Shaped Electrothermal Microactuators

Zhang

2018

Shock and Vibration

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Comprehensive analysis on the modal characteristics of V-shaped electrothermal microactuators is presented in this paper for the first time. Considering the unique geometric characteristics of the V-shaped beam, that is, two inclined beams supporting a movable shuttle, both the lateral and longitudinal deflections are taken into account in the modal analysis. Boundary and continuity conditions are employed to obtain the frequency equation. Natural frequencies are then obtained by solving the frequency equation. Mode shapes corresponding to their natural frequencies are also calculated analytically. e theoretical modal analysis is verified with the finite element analysis using ANSYS software. Based on the model analysis, this paper further investigates the relationship between natural frequencies and the volume scaling of the V-shaped beam. Finally, comprehensive parametric studies in terms of material properties and structural dimensions are conducted to provide insights and guidance in designing the V-shaped beam electrothermal microactuators.

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