2013
DOI: 10.1590/s1516-14392013005000135
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Abstract: The effect of changes in grain size on corrosion resistance of the pure tough pitch copper stripwas investigated in acidic and alkaline NaCl solutions. Accumulative roll bonding as sever plastic process was applied up to 8 cycles to produce the ultrafine graincopper. Polarization and electrochemical impedance tests were used for corrosion resistance investigations. Corrosion morphologies were analyzed by FE-SEM. Results showed that the corrosion resistance decreased up to cycle 2 and increased after rolled for… Show more

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Cited by 31 publications
(3 citation statements)
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“…An improvement in the corrosion characteristics due to nanocrystalline structure has also been reported in the case of Cu-20Zr and Cu-70Zr alloys, [140,141] and pure-Cu synthesized by accumulative roll bonding process and having different grain sizes. [142] Moreover, the extent of localized corro- Corrosion rates of the magnets measured by gravimetric analysis after 1 and 10 min as a function of mean average grain size. [137,138] sion has also been reported to decrease for Cu-based nanocrystalline alloys as compared to the coarse-grained counterparts.…”
Section: Other Nanocrystalline Metals and Alloysmentioning
confidence: 99%
“…An improvement in the corrosion characteristics due to nanocrystalline structure has also been reported in the case of Cu-20Zr and Cu-70Zr alloys, [140,141] and pure-Cu synthesized by accumulative roll bonding process and having different grain sizes. [142] Moreover, the extent of localized corro- Corrosion rates of the magnets measured by gravimetric analysis after 1 and 10 min as a function of mean average grain size. [137,138] sion has also been reported to decrease for Cu-based nanocrystalline alloys as compared to the coarse-grained counterparts.…”
Section: Other Nanocrystalline Metals and Alloysmentioning
confidence: 99%
“…For that reason, the high correlation found between microhardness and electrochemical behaviour is a consequence of the effect of residual stresses. Moreover, it is natural that the residual stress appears as a factor highly correlated to the electrochemical behaviour of the surfaces, as pitting corrosion resistance of the samples is diminished with increased mechanical load, presumably because of the increase in the defect density [18].…”
Section: Discussionmentioning
confidence: 99%
“…Lapeire [15] studied the influence of grain size on the electrochemical behavior of pure copper in 0.1 M HCl and pointed out that for a smaller grain size, a lower corrosion potential and higher corrosion current density were observed. On the contrary, Deng and Nikfahm [16,17] stated that the ultrafine-grained copper enhanced its anti-corrosion behavior. During the cold rolling process, although Cu grain has not experienced recrystallization, the atomic arrangement and surface defect distribution on the microstructure of Cu will be changed by rolling reduction, in which the corrosion properties were still unclear.…”
Section: Introductionmentioning
confidence: 98%