Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing

Wang, Xuegang; DongYuan, Xing; Li, Jianing; Li, Xin-Geng

doi:10.1590/1980-5373-mr-2020-0325

Cited by 6 publications

(2 citation statements)

References 32 publications

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“…Figure 2 showed the schematic diagram of induction brazing for butt Al/Cu joints. The induction brazing process was similar to our previous work 32 . The aluminum plate and the copper plate were fixed using mechanical clamps.…”

Section: Methodsmentioning

confidence: 86%

Influence of Filler Alloy on Microstructure and Properties of Induction Brazed Al/Cu Joints

2022

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This work aimed to clarity the influence of filler alloy on microstructures and properties of induction brazed Al/Cu joints. It was found that the alloying elements in the filler alloy changed the morphology and phase type of interfacial layer in the joint. Mg converted the native Al 2 O 3 film into MgO and stopped the re-oxidation of aluminum. However, excessive Mg caused planar inter-metallic compounds (IMCs) to become wavy, which decrease the ductility of the joint. A suitable amount of Cu and Si removed residual oxide film and resulted in a thin planar IMCs layer, which is beneficial to Al/Cu joint. Al-8Si-4Cu-2Mg-1Ga-0.05Ce filler foil produced an excellent joint consisting of a 2μm Cu 9 Al 4 /CuAl 2 planar layer and free from oxide film. The tensile strength of the joint is higher than that of aluminum. The bend angle is higher 130°. The electrical resistivity of the joint is lower than the theoretical value.

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Section: Methodsmentioning

confidence: 86%

Influence of Filler Alloy on Microstructure and Properties of Induction Brazed Al/Cu Joints

2022

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“…This phenomenon is known as reactive diffusion and has been observed in numerous cases as Cu-Sn (1) , Fe/Sn (2) , Ti-Al (3) , Au-Sn (4) and Ni-Sn (5) . The inter metallic compounds often have properties that are different from the base metals and excessive inter metallic compounds in a couple are detrimental (6) since they alter the mechanical (7) and electrical properties of the joint (8) . Thus, the study of reactive diffusion in binary systems is important for technological as well as for academic purposes.…”

Section: Introductionmentioning

confidence: 99%

Study of Reactive Diffusion in Cu/Zn Diffusion Couple

Khoulif¹,

Hannech²,

Lamoudi³

2022

IJST

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Objective: To study the micro structure of the interfacial region of Cu/Zn diffusion couple at 250 • C and its evolution with diffusion time. Methods: The couple was prepared by a diffusion bonding technique and then annealed at 250 • C in Argon atmosphere. The micro structure resulting from diffusion reactions in the couple was studied by scanning electron microscopy and energy dispersive X-ray. Findings: Two continuous inter metallic phase layers formed at the interface between Cu and Zn metals. The formed inter metallic were ε and γ phases of the Cu-Zn system. The γ layer grew much faster than the ε layer. The growth kinetics of the γ phase layer was parabolic with a growth constant k p = (1, 9 ± 0, 02)10 −13 m 2 s −1 . Novelty: This study suggests that reactive diffusion in Cu/Zn diffusion couple occurs according to a model proposed in this paper.

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Optimization of ultrasonic assisted friction stir welding (UAFSW) of electrical grade AA 6101T-64 and Cu

Nirgude,

Kalpande

2024

Int J Interact Des Manuf

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Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing

Cited by 6 publications

References 32 publications

Influence of Filler Alloy on Microstructure and Properties of Induction Brazed Al/Cu Joints

Influence of Filler Alloy on Microstructure and Properties of Induction Brazed Al/Cu Joints

Study of Reactive Diffusion in Cu/Zn Diffusion Couple

Optimization of ultrasonic assisted friction stir welding (UAFSW) of electrical grade AA 6101T-64 and Cu

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