2003
DOI: 10.1115/1.1615249
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Abstract: The pressure sensor is one of the major applications of microelectromechanical systems (MEMS). An absolute pressure sensor utilizes anodic bonding to create a vacuum cavity between the silicon diaphragm and glass substrate. The manifold absolute pressure (MAP) sensing elements from a new supplier have exhibited negative voltage shifts after exposure to humidity. A hypothesis has been established that poor anodic bonding causes an angstrom-level gap between the silicon substrate and glass. Once moisture enters … Show more

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Cited by 2 publications
(2 citation statements)
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“…For example, package crack growth has a dependence on moisture that is well documented [41]. Also, electrical performance may change as moisture condenses in gaps causing surface tension that may induce a piezoresistive stress effect [42]. Perhaps best known is the relationship of adhesion and friction of polycrystalline silicon MEMS [43].…”
Section: Humiditymentioning
confidence: 99%
“…For example, package crack growth has a dependence on moisture that is well documented [41]. Also, electrical performance may change as moisture condenses in gaps causing surface tension that may induce a piezoresistive stress effect [42]. Perhaps best known is the relationship of adhesion and friction of polycrystalline silicon MEMS [43].…”
Section: Humiditymentioning
confidence: 99%
“…Operational environment, like failure modes, can affect the function or lifetime of a MEMS device. The need to better understand environmental effects on MEMS initiated investigations that span effects such as temperature [34,35], relative humidity [36,37], vibration [38], and shock [39,40]. Knowledge gained from studying environmental effects on MEMS lead to the development of more robust methods of packaging the devices.…”
Section: Mems Actuatorsmentioning
confidence: 99%