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Cited by 42 publications
(44 citation statements)
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“…Similar thin film growth behavior was verified by electrochemical defect-mediated growth for silver/gold or copper films in aqueous solution. [28,29] When electrodeposition time increased to 30 min, tin-doped silicon islands were connected together and formed island aggregations (Figure 5c), named as the third step. Finally, as the time increased to 90 min, tin-doped silicon island aggregations continued to grow normal to the substrate and gradually formed a dense and coherent film.…”
Section: Resultsmentioning
confidence: 99%
“…Similar thin film growth behavior was verified by electrochemical defect-mediated growth for silver/gold or copper films in aqueous solution. [28,29] When electrodeposition time increased to 30 min, tin-doped silicon islands were connected together and formed island aggregations (Figure 5c), named as the third step. Finally, as the time increased to 90 min, tin-doped silicon island aggregations continued to grow normal to the substrate and gradually formed a dense and coherent film.…”
Section: Resultsmentioning
confidence: 99%
“…It was also shown by Rutherford backscattering (RBS) that the asgrown Ag layer is Pb free [184]. Later Kwak et al [193] extended the applicability of DMG to the growth of 100-MLthick epitaxial copper film on Au (111) substrate (Fig. 27.41).…”
Section: Defect-mediated Growthmentioning
confidence: 99%
“…Thus, the authors of [193] proved the DMG superiority to other existing deposition techniques by managing to handle deposition in a layer-by-layer mode in a heteroepitaxial system featuring atomic mismatch as large as 11% [193]. The crystallographic orientation and continuity of the ultrathin copper layer in [193] was ascertained by XRD and cyclic voltammetry of Pb UPD on bare and Cu-coated Au (111), respectively.…”
Section: Defect-mediated Growthmentioning
confidence: 99%
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