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Cited by 177 publications
(189 citation statements)
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References 192 publications
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“…[23][24][25] As comprehensively reviewed elsewhere, [26][27][28][29][30] and as discussed to an introductory level in a following section of this review (Section 2), formation of molecular layers on crystalline silicon surfaces without an intervening oxide layer is an extremely appealing approach toward robust layers on a surface. [31][32][33][34] Silicon-carbon linked monolayers on silicon substrates are expected to complement and/or extend the applications of the currently most relevant technological material 35 toward the development of atomic scale devices, [36][37][38] diverse molecular devices, [39][40][41][42][43][44][45][46][47][48] and well-defined sensing interfaces. [49][50][51][52][53] The following sections are intended as an up-to-date presentation of the topic of molecular layers on non-oxidized silicon surfaces.…”
Section: Jason B Harpermentioning
confidence: 99%
“…[23][24][25] As comprehensively reviewed elsewhere, [26][27][28][29][30] and as discussed to an introductory level in a following section of this review (Section 2), formation of molecular layers on crystalline silicon surfaces without an intervening oxide layer is an extremely appealing approach toward robust layers on a surface. [31][32][33][34] Silicon-carbon linked monolayers on silicon substrates are expected to complement and/or extend the applications of the currently most relevant technological material 35 toward the development of atomic scale devices, [36][37][38] diverse molecular devices, [39][40][41][42][43][44][45][46][47][48] and well-defined sensing interfaces. [49][50][51][52][53] The following sections are intended as an up-to-date presentation of the topic of molecular layers on non-oxidized silicon surfaces.…”
Section: Jason B Harpermentioning
confidence: 99%
“…After substrate functionalization the most critical step in the fabrication of SAMs junctions is the deposition of the top electrode, as it can compromise the integrity of the underlying molecular layer. The influence of the deposition conditions has been widely studied in other systems, 28,[40][41][42][43] and soft-electrode transfer or indirect evaporation reported as the less harming methods to the SAM. In our case we have also found that direct metal evaporation is capable of maintaining the quality SAMs for low enough deposition rates and temperatures (see Experimental section for more details).…”
Section: Sams To Passivate the Metal-semiconductor Interfacementioning
confidence: 99%
“…[67,69,70,92,[94][95][96]187] Evaporated Au or Cu on CH 3 ÀSi(111) interacts with the Si to form SiAu 3 or SiCu 3 , which detach the molecules from the surface. [67] Similarly, a monolayer of C 18 ÀSi(111) is generally destroyed by evaporation of Au or Ti, but not of Ag because of their different reactivity toward Si.…”
Section: Sources Of Defects and How To Avoid Themmentioning
confidence: 99%