Phthalonitrile‐based high temperature resin

Keller, Teddy M.

doi:10.1002/pola.1988.080261207

Cited by 236 publications

(164 citation statements)

References 6 publications

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“…These resins have been considered as an ideal material for applications in various fields such as marine, aerospace and electronic uses [4][5][6][7][8]. However, the conventional phthalonitriles have the problem of poor processability resulting from their unexpected properties such as high curing temperature, long curing time and narrow processing window (temperature between the melting point and the polymerization temperature) [9,10].…”

Section: Introductionmentioning

confidence: 99%

Self-promoted curing phthalonitrile with high glass transition temperature for advanced composites

et al. 2012

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A novel self-promoted curing phthalonitrile monomer was synthesized via substitution reaction of 4-nitrophthalonitrile and 3-aminophenol at the presence of K 2 CO 3 in the dimethylsulfoxide solvent. The phthalonitrile was characterized by Fourier transform infrared spectra, nuclear magnetic resonance, gel permeation chromatography, differential scanning calorimetry, dynamic rheological analysis and thermal gravimetric analysis. The phthalonitrile monomer can be thermally polymerized with self-promoted curing behaviors. The prepolymerization reaction of the phthalonitrile prepolymer was investigated and the phthalonitrile prepolymer exhibited the desirable processing feature. With the curing process of low curing temperature and short curing time, the cured polymers exhibited high glass transition temperatures (241-270°C) and excellent thermal stabilities with the 5 % weight loss temperature (395-441°C). The novel phthalonitrile can be a good candidate as matrix for high performance polymeric materials.

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Section: Introductionmentioning

confidence: 99%

Self-promoted curing phthalonitrile with high glass transition temperature for advanced composites

et al. 2012

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“…Poly (arylene ether nitrile) (PEN), one of the highperformance engineering thermoplastics, has been widely used in microelectronic industry, aerospace, electrical insulation, and semiconductor industries due to its outstanding properties such as high thermal stabilities, high thermooxidative stabilities, excellent mechanical and chemical inertia [1][2][3][4][5][6][7][8]. Despite the advantages of the PEN, the integrated circuit need low dielectric constant materials at high frequency [9].…”

Section: Introductionmentioning

confidence: 99%

Low dielectric permittivity and high thermal stability composites based on crosslinkable poly (arylene ether nitrile) and hollow glass microsphere

Zou

Zhan

Zhao

et al. 2012

J Mater Sci: Mater Electron

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Crosslinkable poly (arylene ether nitrile)/hollow glass microsphere (PEN/HGM) composites with relative low dielectric permittivity and high thermal stability were prepared by a solution mixing and thermal compression method. For achieving this purpose, HGM were tight embedded in network, which were formed by crosslinking reaction of PEN end-capped with phthalonitrile. Compared to pure PEN, the dielectric constant of the resulting composite with 15 wt% of HGM reduced from 4.1 to 2.7 at 100 kHz, and the dielectric loss decreased from 2.0 9 10 -2 to 0.8 9 10 -2 at 100 kHz. Furthermore, the as-prepared composites showed significant enhancement in glass transition temperature (increased by 64°C) and onset thermal degradation temperature (increased by 41°C). Therefore, such composites were expected to find their applications area such as integrated circuit where needs low dielectric constant, low dielectric loss and high thermal stability.

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“…Various bisphenols have been studied for synthesis of PEN via nucleophilic aromatic substitution polymerization, these PEN materials exhibit excellent thermal stabilities over a wide-range of temperature [1][2][3][4][5][6]. The cyano group serves as a potential site for crosslinking reaction and can make polymer transform from thermoplastic to thermosetting [7][8][9][10][11]. Matsuo et al [3] systematically studied the synthesis of 2,6-dihalobenzonitrile with different kinds of bisphenol including the 4,4'-dihydroxybiphenyl and found that mechanical properties of biphenylbased PEN were better than that of the corresponding ketone or sulfone containing polymers.…”

Section: Introductionmentioning

confidence: 99%

Synthesis, characterization and rheological property of biphenyl-based polyarylene ether nitrile copolymers

Liu¹,

Du²,

Hao³

et al. 2007

Express Polym. Lett.

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Abstract. The high molecular weight biphenyl-based polyarylene ether nitrile copolymers were synthesized by nucleophilic substitution reaction of 2,6-dichlorobenzonitrile (DCBN) with varying molar ratios of 4,4'-dihydroxybiphenyl (BP) and hydroquinone (HQ). The BP content of the copolymers has influence on glass transition temperature (Tg), initial decomposition temperature (Tid), mechanical properties and the crystallinity. All the copolymers could be dissolved in NMP, DMF and DMAc on heating, and were stable up to 450°C with a high char yield above 50% at 800°C in nitrogen atmosphere. The glass transition temperature, the melting temperature and tensile strength of copolymers were found to increase with increase in concentration of the BP units in the polymer. The dynamical viscosity and the storage modulus have been influenced by the BP concentration, frequency, temperature and time. This rheological results show that these copolymers have best thermoplastic processability and stability at 300-400°C.

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Phthalonitrile‐based high temperature resin

Cited by 236 publications

References 6 publications

Self-promoted curing phthalonitrile with high glass transition temperature for advanced composites

Self-promoted curing phthalonitrile with high glass transition temperature for advanced composites

Low dielectric permittivity and high thermal stability composites based on crosslinkable poly (arylene ether nitrile) and hollow glass microsphere

Synthesis, characterization and rheological property of biphenyl-based polyarylene ether nitrile copolymers

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