In recent years, thin layered indium selenide (In2Se3) has attracted rapidly increasing attention due to its fascinating properties and promising applications. Here, we report the temperature-driven α-β phase transformation and the enhanced electronic property of 2H α-In2Se3. We find that 2H α-In2Se3 transforms to β-In2Se3 when it is heated to a high temperature, and the transformation temperature increases from 550 to 650 K with the thickness decreasing from 67 to 17 nm. Additionally, annealing the sample below the phase transformation temperature can effectively improve the electronic property of a 2H α-In2Se3 field-effect transistor, including increasing the on-state current, decreasing the off-state current, and improving the subthreshold swing. After annealing, not only the contact resistance decreases significantly but also the mobility at 300 K increases more than 2 times to 45.83 cm2 V–1 s–1, which is the highest among the reported values. Our results provide an effective method to improve the electrical property and the stability of the In2Se3 nanodevices.
We report a tunneling diode enabling efficient and dense electron emission from SiO2 with low poisoning sensitivity. Benefiting from the shallow SiO2 channel exposed to vacuum and the low electron affinity of SiO2 (0.9 eV), hot electrons tunneling into the SiO2 channel from the cathode of the diode are efficiently emitted into vacuum with much less restriction in both space and energy than those in previous tunneling electron sources. Monte Carlo simulations on the device performance show an emission efficiency as high as 87.0% and an emission density up to 3.0 × 105 A/cm2. By construction of a tunneling diode based on Si conducting filaments in electroformed SiO2, an emission efficiency up to 83.7% and an emission density up to 4.4 × 105 A/cm2 are experimentally realized. Electron emission from the devices is demonstrated to be independent of vacuum pressure from 10–4 to 10–1 Pa without poisoning.
Vacuum triodes have been scaled down to the microscale on a chip by microfabrication technologies to be vacuum transistors. Most of the reported devices are based on field electron emission, which suffer from the problems of unstable electron emission, poor uniformity, and high requirement for operating vacuum. Here, to overcome these problems, a vacuum transistor based on field−assisted thermionic emission from individual carbon nanotubes is proposed and fabricated using microfabrication technologies. The carbon nanotube vacuum transistor exhibits an ON/OFF current ratio as high as 104 and a subthreshold slope of ~4 V·dec−1. The gate controllability is found to be strongly dependent on the distance between the collector electrodes and electron emitter, and a device with the distance of 1.5 μm shows a better gate controllability than that with the distance of 0.5 μm. Benefiting from field−assisted thermionic emission mechanism, electric field required in our devices is about one order of magnitude smaller than that in the devices based on field electron emission, and the surface of the emitters shows much less gas molecule absorption than cold field emitters. These are expected to be helpful for improving the stability and uniformity of the devices.
On-chip microscale vacuum chambers with high sealing performance and electrical feedthroughs are highly desired for microscale vacuum electronic devices and other MEMS devices. In this paper, we report an on-chip microscale vacuum chamber which achieves a high sealing performance by using monolayer graphene as lateral electrical feedthrough. A vacuum chamber with the dimensions of π × 2 mm × 2 mm × 0.5 mm is fabricated by anodically bonding a glass chip with a through-hole between two Si chips in a vacuum, after monolayer graphene electrodes have been transferred to the surface of one of the Si chips. Benefiting from the atomic thickness of monolayer graphene, the leak rate of Si–glass bonding interface with a monolayer graphene feedthrough is measured at less than 2 × 10−11 Pa·m3/s. The monolayer graphene feedthrough exhibits a minor resistance increase from 22.5 Ω to 31 Ω after anodic bonding, showing good electrical conductance. The pressure of the vacuum chamber is estimated to be 185 Pa by measuring the breakdown voltage. Such a vacuum is found to maintain for more than 50 days without obvious degradation, implying a high sealing performance with a leak rate of less than 1.02 × 10−16 Pa·m3/s.
Optical synapse is the basic component for optical neuromorphic computing and is attracting great attention, mainly due to its great potential in many fields, such as image recognition, artificial intelligence and artificial visual perception systems. However, optical synapse with infrared (IR) response has rarely been reported. InAs nanowires (NWs) have a direct narrow bandgap and a large surface to volume ratio, making them a promising material for IR detection. Here, we demonstrate a near-infrared (NIR) (750 to 1550 nm) optical synapse for the first time based on a poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE))-coated InAs NW field-effect transistor (FET). The responsivity of the P(VDF-TrFE)-coated InAs NW FET reaches 839.3 A/W under 750 nm laser illumination, demonstrating the advantage of P(VDF-TrFE) coverage. The P(VDF-TrFE)-coated InAs NW device exhibits optical synaptic behaviors in response to NIR light pulses, including excitatory postsynaptic current (EPSC), paired-pulse facilitation (PPF) and a transformation from short-term plasticity (STP) to long-term plasticity (LTP). The working mechanism is attributed to the polarization effect in the ferroelectric P(VDF-TrFE) layer, which dominates the trapping and de-trapping characteristics of photogenerated holes. These findings have significant implications for the development of artificial neural networks.
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