Thin films can develop large residual stresses during their growth that significantly impact their performance. Therefore, there is a need to understand how the stress is related to the developing film structure and underlying kinetic processes. In this work, we describe measurements of stress and the corresponding grain structure during electrodeposition of Ni and Cu films. For Ni deposition, the grain size stays nearly constant during growth and the stress reaches a nearly constant steady-state. For Cu deposition, the grain size grows as the thickness increases and the microstructural evolution affects the evolution of the stress. To remove the effect of subsurface grain growth on the stress, measurements were also done with periodic pauses that allowed the stress induced by grain growth to saturate. We interpret the results in terms of a kinetic model for stress evolution that focuses on the developing boundary between adjacent grains while the film is deposited. The effect of grain growth on stress for different types of microstructural evolution is also discussed. After accounting for the stress from subsurface grain growth, the results are consistent with the model for the dependence on growth rate and grain size at the surface.

Residual stress during thin film deposition is affected by the evolution of the microstructure. This can occur because subsurface grain growth directly induces stress in the film and because changing the grain size at the surface affects the stress in new layers as they are deposited. We describe a new model for stress evolution that includes both of these effects. It is used to explain stress in films that grow with extensive grain growth (referred to as zone II) so that the grain size changes throughout the thickness of the layer as the film grows. Equations are derived for different cases of high or low atomic mobility where different assumptions are used to describe the diffusion of atoms that are incorporated into the grain boundary. The model is applied to measurements of stress and grain growth in evaporated Ni films. A single set of model parameters is able to explain stress evolution in films grown at multiple temperatures and growth rates. The model explains why the slope of the curvature measurements changes continuously with thickness and attributes it to the effect of grain size on new layers deposited on the film.

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