Due to rapid growth in the mobile industry, Package-onPackage (PoP) has been widely adopted for 3D integration of logic and memory devices within mobile handsets, and other portable multimedia products, etc. Typical PoP configuration includes a logic function in the bottom package while memory dice are assembled into the top package. The TMV solution is widely adopted to reduce package warpage, to achieve a fine pitch PoP, and to stabilize stacking performance. Another big benefit of the TMV is to generate a thin structure by exposing the back side of the die using a film assist mold system. However, the trend of mobile devices is going thinner and thinner, and there is a limitation to achieve the thin PoP structure. The most difficult barrier to generate the thin PoP structure is the warpage control. In this paper, a strip grinding process is introduced as a solution to generate thinner PoP structures in overmolded packages. Applying the strip grinding process to exposed die, reducing mold clearance, and exploring double sided mold structures to reduce die/package height were also investigated.
Package-on-package (PoP) has been widely adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. Typical PoP solution is applied to logic processor as bottom package and memory device as top package. TMV ® solution is being applied to reduce the warpage and achieve the fine pitch PoP and stable stacking performance. Currently, 0.4mm MIF(Memory Interface Pitch) is the minimum pitch under production and more fine MIF pitch is being requested because more functions are being integrated on chip then chip size becomes larger even wafer node is going narrower. To sustain the similar package size with larger chip size, fine pitch PoP is required. In this paper, 0.3 and 0.27mm MIF pitch PoP will be studied as a solution for fine pitch PoP and as a interface material between Top and Bottom package, solder ball and Cu post will be evaluated.
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