The anodic dissolution behaviours of Cu, Zr and Cu–Zr alloy were analysed in LiCl–KCl at 500°C by anode polarization curve and potentiostatic polarization curve. The results show that the initial and fast-dissolving potentials of Cu are −0.50 and −0.29 V, and Zr are −1.0 and −0.88 V, respectively. But, in the Cu–Zr alloy, the initial and fast-dissolving potentials of Cu are −0.52 and −0.41 V, and Zr are −0.96 and −0.92 V, respectively. The potentials satisfy the selection dissolution principle that Zr in the alloy dissolves first, while Cu is left in the anode and is not oxidized. The passivation phenomenon of Zr is observed in the quick dissolution of Zr, while it is not observed in the Cu–Zr alloy. Moreover, from the above anodic dissolution results, potentiostatic electrolysis of Cu–Zr alloy was carried out at −0.8 V for 40 min, and the anodic dissolution mechanism and kinetics of Zr in Cu–Zr alloy were also discussed. In the initial stage, Zr dissolves as Zr4+ ions from the alloy surface and enters into the molten salt, leaving a Cu layer called ‘dissolving layer’ on the surface of the alloy. After that, another layer between the matrix and ‘dissolving layer’ called ‘diffusion–dissolution layer’ appears. Zr diffuses in the alloy matrix and dissolves as Zr4+ ions on the surface of the ‘diffusion–dissolution layer’ continuously, and Zr4+ ions diffuse through the ‘dissolving layer’ and enter into the molten salt finally. In addition, the factors affecting the dissolution of Cu–Zr alloy, such as time and potential, were also investigated. The dissolution loss increases with the increasing dissolution potential and time, while the dissolution rate increases with the increasing dissolution potential and declines with the prolonging dissolution time.
Phthalonitrile resin/exfoliated hexagonal boron nitride ( h-BN) composites with high thermal conductivity were fabricated using a novel approach. The route included two steps, micro- h-BN was coated and dispersed by phthalonitrile monomers via the function of heterogeneous nucleation, and then micro- h-BN was exfoliated by heat release during the phthalonitrile curing process. The composites achieved a high thermal conductivity of 0.736W (m·K)−1 containing 20 wt% micro- h-BN, which is 3.17 times higher than that of pure phthalonitrile resin at 0.232W (m·K)−1. Compared to traditional routes, the novel preparation approach requires less BN fillers when improving the same thermal conductivity. Importantly, other thermosetting polymers can also encapsulate BN through this strategy, which paves a new way for preparing thermally conductive thermosetting polymer–matrix composites.
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