Photovoltaic (PV) cells are of immense interest due to their vast application potential in the fields of energy and communication. [1][2][3] The adoption of ideal photoactive material and the design of optimum device structure are critical to achieving low-cost, high-efficiency PV cells. The semiconducting single-walled carbon nanotubes (SWNTs) are potentially an attractive material for PV applications due to their many unique structural and electrical properties. They are almost defect free to greatly decrease carrier recombination, bear a wide range of direct bandgaps matching the solar spectrum, [4][5][6] and show strong photoabsorption [7][8][9][10] and photoresponse [11][12][13][14][15] from ultraviolet to infrared, and exhibit high carrier mobility [16] and reduced carrier transport scattering. [17,18] Indeed, previous studies had attempted to fabricate SWNT films into photoelectrochemical solar cells. [19] However, due to the inefficient separation and collection of photoexcited carriers and large intertube interaction, the maximum monochromatic incident photo-to-current conversion efficiency (IPCE) obtained for the cell is only 0.15%. Here, we report a novel approach that enables fabricating SWNT PV solar microcells with high power-conversion efficiency. In this cell, a directed array of monolayer SWNTs was nanowelded onto two asymmetrical metal electrodes with high and low work functions, respectively, resulting in a strong built-in electric field in SWNTs for efficient separation of photogenerated electron-hole pairs. Under solar illumination, the monolayer SWNT PV cell shows a power conversion efficiency of 0.80% and 0.31% at an illumination intensity of 8.8 W cm À2 and 100 mW cm À2 , respectively. Correspondingly, a remarkable efficiency of 12.6% and 5.1% was estimated based on the actual absorbed incident power. Our results demonstrate the exciting application potential of SWNTs for PV devices.A schematic diagram of our SWNT PV cell is shown in Figure 1a. In the experiment, Pd and Al metals, with a high and a low work function (F) of 5.1 eV and 4.1 eV, respectively, [20] were chosen as the drain and source contact electrodes. Using standard UV lithography and lift-off process, the two metals were patterned by the overlay on silicon wafers with a 500-nm thermally oxidized layer, forming the parallel electrode pairs. The electrodes were 150 nm in thickness, 40 mm in width, 50 mm in length, and separated by 500 nm. A 200-nm-thick Al electrode was sputtered on the back of Si substrate, through which a gate voltage was supplied to the Si substrate for modulating the SWNT-metal contact barrier. The SWNTs synthesized by the catalytic chemical vapor deposition (CVD) method with an average diameter of 0.9 nm (F % 4.5 eV, E g % 1.1 eV [21] ) were dispersed fully in chloroform and aligned onto the source and drain electrodes by an AC dielectrophoresis method to form the dispersed parallel SWNT bundle array. [22] Then, an ultrasonic nanowelding technique was applied to bond the SWNTs onto the metal electrodes. [...