Gold nanoclusters have attracted extensive interest for catalysis applications in recent years due to their ultrasmall sizes and well-defined compositions and structures. However, at least two challenges exist in this emerging field. First, the steric hindrance of the ligands inhibits the catalysis activity, and second, the mechanism underlying water-phase catalysis using gold nanoclusters is often ambiguous. Herein, we introduce a “kill two birds with one stone” strategy to address these two challenges via the use of host–guest chemistry. As an illustration, a novel adamantanethiolate-protected Au40(S-Adm)22 nanocluster was synthesized, bound with γ-CD-MOF, and then transferred to the HRP-mimicking reaction system. The as-obtained catalyst exhibits excellent water solubility and catalytical activity, totally different from the virgin Au40(S-Adm)22 nanoclusters. Further, the detailed HRP-mimicking catalysis mechanism was proposed and supported by DFT calculation. Another interesting finding is the unique structure of Au40(S-Adm)22, which can be regarded as an Au13 icosahedron unit derived structure but different from the widely reported icosahedron contained nanocluster where the Au13 icosahedrons are often centered. These novel, intriguing results have important implication for the property tuning and practical application of metal nanoclusters in the future.

Figure of merit (FOM), the ratio of electrical conductance to optical transparency, is an important metric to evaluate transparent conductive film (TCF). The conductivity of commonly used flexible TCF such as indium tin oxide is generally limited and their FOM is lower than 300. In this study, a high‐performance copper (Cu) metal‐mesh TCF with the highest FOM ever reported, up to 8 × 104, is fabricated through an additive manufacturing process of blading a silver seed layer and selective electroplating of Cu. With this strategy, Cu metallic lines completely constrained in roll‐to‐roll imprinted microgrooves achieve high aspect ratio of 2 with 4 µm width and 8 µm depth, which has very clean and smooth edges. This embedded Cu metal mesh exhibits an ultralow sheet resistance down to 0.03 Ω □−1 at 86% optical transmittance. It is demonstrated that the Cu metal mesh has remarkable mechanical flexibility, high environmental stability at high temperature and humidity, and durability over repeated heating cycles. The Cu metal mesh is employed as a flexible transparent heater to attach to the windshield of a car, showing rapid heating at low voltage and effective removal of snow.