A new technique for the fabrication and integration of various waveguide components together with an integrated E-plane circuit to form a compact millimetre-wave subcomponent has been produced. These waveguide components were fabricated in two halves using SU-8 such that the circuits can be placed in the E-plane of the waveguide and accommodated in a specially designed metal block for measurement. This technique is sufficiently flexible and repeatable so as to permit complex 3-D waveguide components with low loss and excellent surface fmish to he realised at low cost. Various rectangular waveguide sections with operating frequencies from I10 to 320 GHz have been fabricated and measured to evaluate this approach.
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