TiB2, along with MgO and Mg3B2O6, was formed by a thermite reaction between Mg, amorphous B2O3, and TiO2 powders in argon. The mixture 5Mg–TiO2–B2O3 along with binary mixtures and single components were analyzed using differential thermal analysis (DTA) and x-ray diffraction (XRD). Large (25 g) specimens were also ignited in bulk using a resistance-heated nichrome wire. The reaction path in forming TiB2 in the three component mixture was deduced. Mg reduces TiO2 and B2O3 to form Ti and MgB2, respectively, which in turn react to form TiB2. In an oxidizing atmosphere, the significant speed of the reaction permitted solid state reaction to form TiB2 before atmospheric oxygen could diffuse into the powder mass and react to form oxide phases. Thermite reactions in air have the advantage (over furnace heating in air) of not providing time at elevated temperatures for Mg and intermediate products to become consumed in the formation of oxides, nor time for oxidation degradation of TiB2.
This paper presents for the first time the design, implementation, measurements, reliability data and integration of multiple RF components such as filters, baluns, diplexers, and a combination of the above on Liquid Crystalline Polymer (LCP) based substrates for communication standards such as 802.11 a/b/g, LMDWMMDS, sa1,ellitddigital TV, UWB, cellular and Bluetooth type applications.These components and process technologies are being targeted as a cost-effective high-performance, miniaturized alternative to the primary technologies of choice for multihand RF/wireless applications, namely, low-temperature co-fired ceramic (LTCC), multi-layer ceramic (MLC) and ceramic monoblock technologies.The first examples of this platform substrate technology are very compact 12"' fully packaged SMT 6ont-end filters with center frequencies of2.45, 5.25 and 5.775 GHz. One embodiment of the filter at 2.45 GHz, which is well suited for 802.11 b/g and Bluetooth type applications, provides a passband of 100 MHz with maximum inhand insertion loss less than 1.7dB at 2 5 T , greater than 25dB attenuation at 2700-2800 MHz, greater than lOdB attenuation below ;!.2GHz, greater than 20dB rejection at the second and third harmonic and inhand VSWR less than 1.5 matched to 50 Ohms at the input and output.
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