This paper presents the results of an experimental study of the effects of cyclic damage and adhesion on nanoscale Au thin films deposited on a flexible poly(dimethyl-siloxane) substrate. The deformation and cracking mechanisms are elucidated as functions of film thickness. The implications of the results are also discussed for the design of stretchable electronic structures.

This paper presents the results of atomic force microscopy (AFM) measurements of the adhesion between materials relevant to organic solar cells and organic light-emitting devices. The adhesion is quantified using pull-off forces obtained for organic-organic, organic-inorganic, and inorganic-inorganic interfaces. The measured pull-off forces and surface parameters are then incorporated into theoretical models for the estimation of surface energies. The implications of the results are then discussed for the design of enhanced robustness in organic electronic structures.

This paper presents the results of an experimental study of the adhesion between bi-material pairs that are relevant to organic light emitting devices, hybrid organic/inorganic light emitting devices, organic bulk heterojunction solar cells, and hybrid organic/inorganic solar cells on flexible substrates. Adhesion between the possible bi-material pairs is measured using force microscopy (AFM) techniques. These include: interfaces that are relevant to organic light emitting devices, hybrid organic/inorganic light emitting devices, bulk heterojunction solar cells, and hybrid combinations of titanium dioxide (TiO 2) and poly(3-hexylthiophene). The results of AFM measurements are incorporated into the Derjaguin-Muller-Toporov model for the determination of adhesion energies. The implications of the results are then discussed for the design of robust organic and hybrid organic/inorganic electronic devices. V

MPa were applied to organic light emitting diodes containing either evaporated molybdenum trioxide (MoO 3) or spin-coated poly(3,4-ethylene dioxythiophene) doped with poly(styrene sulphonate) (PEDOT:PSS) hole-injection layers (HILs). The threshold voltages for both devices were reduced by about half, after the application of pressure. Furthermore, in an effort to understand the effects of pressure treatment, finite element simulations were used to study the evolution of surface contact between the HIL and emissive layer (EML) under pressure. The blister area due to interfacial impurities was also calculated. This was shown to reduce by about half, when the applied pressures were between $5 and 8 MPa. The finite element simulations used Young's modulus measurements of MoO 3 that were measured using the nanoindentation technique. They also incorporated measurements of the adhesion energy between the HIL and EML (measured by force microscopy during atomic force microscopy). Within a fracture mechanics framework, the implications of the results are then discussed for the pressure-assisted fabrication of robust organic electronic devices. V

The role of thermal gradients and their attendant mechanical stresses in the overall stability of organic electronic devices has been elucidated through the occurrence of spiral shaped blisters that develop on the surface of suitably biased polymer light emitting diodes. A model based on the spontaneous disordering (or ordering) of polymeric thin film systems has been used to explain the formation and growth of these blisters. The model is shown to provide insights into how thermal stresses affect the overall stability of organic electronic devices. The implications of the results are then discussed for the design of flexible organic electronic devices.