Stacking faults expanded by the application of forward current to 4H-SiC p–i–n diodes were observed using a transmission electron microscope to investigate the expansion origin. It was experimentally confirmed that long-zonal-shaped stacking faults expanded from basal-plane dislocations converted into threading edge dislocations. In addition, stacking fault expansion clearly penetrated into the substrate to a greater depth than the dislocation conversion point. This downward expansion of stacking faults strongly depends on the degree of high-density minority carrier injection.
We investigated the structures and expansion behavior of double-Shockley stacking faults (DSFs) formed in heavily nitrogen-doped 4H-SiC during annealing. Heavily doped epilayers prepared as specimens were successively annealed. Various types of DSFs showing different shapes and dislocation contrasts were found in photoluminescence and synchrotron X-ray topography images. Taking account of every possible stacking sequence forming DSFs, the structures of various types of DSFs were determined from observations by plan-view transmission electron microscopy (TEM) and cross-sectional high-angle annular dark-field scanning TEM. We found that a bounding dislocation enclosing a DSF splits into two partial dislocations (PDs), and their Burgers vectors are identical, while the distance of the two PDs depended on their core structures (30° Si-, 30° C- or 90° C-core). We also discussed the contrast rule for the dislocation consisting of two PDs in the synchrotron X-ray topography images and the mobile PDs for the DSF expansion in the epilayers with different nitrogen concentrations.
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