a b s t r a c tCurrently available life cycle assessment (LCA) tools provide only a rough estimation of the environmental impact of different manufacturing operations (e.g. energy consumption). To address this limitation, a web-based and application programming interface (API) based process analysis software tools were developed to estimate the energy consumption of a computer numerically controlled (CNC) machine tool operation and to evaluate its environmental impact as a first step towards sustainable manufacturing analysis. Acceleration/deceleration of machine tool axes and the direction of axes movement were considered to estimate the total energy demand and processing time of the machine tool operation. Several tool path generation schemes were tested to analyze the energy consumption and resulting green house gas emission of CNC machine tool operation. It showed that tool path generation schemes affect the amount of energy and the processing time required to machine the same part, and location of the machining resulted in different amount and characteristics of green house gas emission.

Copper CMP is a corrosion-wear process, in which mechanical and chemicalelectrochemical phenomena interact synergistically. Existing models generally treat copper CMP as a corrosion enhanced wear process. However, the underlying mechanisms suggest that copper CMP would be better modeled as a wear enhanced corrosion process, where intermittent asperity/abrasive action enhances the local oxidation rate, and is followed by time-dependent passivation of copper. In this work an integrated tribo-chemical model of material removal at the asperity/abrasive scale was developed. Abrasive and pad properties, process parameters, and slurry chemistry are all considered. Three important components of this model are the passivation kinetics of copper in CMP slurry chemicals; the mechanical response of protective films on copper; and the interaction frequency of copper with abrasives/pad asperities. The material removal rate during copper CMP was simulated using the tribo-chemical model, using input parameters obtained experimentally in accompanying research or from the literature.

Millisecond scale benzotriazole (BTA) adsorption kinetics in acidic aqueous solution containing 0.01M glycine and 0.01M BTA have been investigated. Chronoamperometry was used to measure current densities on the surface of a micro-copper electrode in pH 4 aqueous solutions containing 0.01M glycine with or without 0.01M BTA. In the presence of BTA the current density decreased as the inverse of the square root of time for a few seconds due to adsorption of BTA. At potentials above 0.4V saturated calomel electrode the current leveled off after a second or so due to the formation of a Cu(I)BTA monolayer on the copper surface. Based on these data a governing equation was constructed and solved to determine the initial kinetics of BTA adsorption. Analysis shows that material removal during copper chemical mechanical planarization (CMP) in this slurry chemistry occurs mostly by direct dissolution of copper species into the aqueous solution rather than mechanical removal of oxidized or pure copper species and that each interaction between a pad asperity and a given site on the copper removes only a small fraction of the Cu(I)BTA species present at that site.

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The efficiency of a pad asperity and abrasives embedded between the asperity and wafer at removing the protective material on the surface of copper (removal efficiency) during chemical mechanical planarization (CMP) was determined experimentally using current densities from in situ electrochemical measurements while polishing with a slurry containing BTA. The removal efficiency was insentitive to the pressure and sliding velocity, but was dictated by the pad surface topography parameters and abrasive concentration in the slurry. An analytical estimate was derived by comparing the trajectories of a pad asperity and the abrasives embedded in the asperity. Comparison of the experimental and analytical estimate suggests that the asperities are deformed enough by the embedded abrasives to contact the surface of copper at abrasive concentrations up to 1 wt%. At higher concentrations up to 5 wt%, the asperities deflected to a lesser amount, making the force exerted on the copper increase. At these higher concentrations, some of the copper interacting with the squeezed abrasives was plastically deformed, yielding higher removal efficiency than when elastically deformed. The removal efficiency can be used as a standard metric for assessing the material removal ability of various consumables such as slurry, CMP pad and pad conditioner.