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The amount of absorbed light in thin photoresist films is a key parameter in photolithographic processing, but its experimental measurement is not straightforward. The optical absorption of metal oxide-based thin photoresist films for extreme ultraviolet (EUV) lithography was measured using an established methodology based on synchrotron light. Three types of materials were investigated: tin cage molecules, zirconium oxoclusters, and hafnium oxoclusters. The tin-containing compound was demonstrated to have optical absorption up to three times higher than conventional organic-based photoresists have. The absorptivity of the zirconium oxocluster was comparable to that of organic polymer-based photoresists, owing to the low absorption cross section of zirconium at EUV. The hafnium-containing resist shows about twice as high absorptivity as an organic photoresist, owing to the significantly higher absorbance of hafnium. From the chemical composition and crystal structure, the density of the spin-coated films was determined. Using the density of the films and the tabulated data for atomic cross section at EUV, the expected absorptivity of these resists was calculated and discussed in comparison to the experimental results. The agreement between measured and expected absorption was fairly good with some substantial discrepancies due to differences in the actual film density or to thickness inhomogeneity due to the spin coating. The developed method here enables the accurate measurement of the EUV absorption of the photoresists and can contribute to the further development of EUV resists and more accurate lithographic modeling.

The 3ω method was employed to determine the effect of nitrogen doping (5 at.%) on the thermal conductivity of sputtered thin films of stoichiometric GeTe (a material of interest for phase change memories). It was found that nitrogen doping has a detrimental effect on the thermal conductivity of GeTe in both phases, but less markedly in the amorphous (–25%) than in the crystalline one (–40%). On the opposite, no effect could be detected on the measured thermal boundary resistance between these films and SiO2, within the experimental error. Our results agree with those obtained by molecular dynamic simulation of amorphous GeTe. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

The thermal properties of the phase-change chalcogenide alloy Ge2Sb2Te5 in its three phases (amorphous, cubic, and hexagonal) and of Si3N4 and SiO2 have been studied to obtain reliable values for device modeling. Thermal conductivity was determined, along with a quantitative estimation of the thermal resistances of the layers’ interfaces, not negligible for highly scaled devices. Electrical resistivity of the chalcogenide material has also been investigated during the phase transition by in situ measurement at constant heating rate.