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We report on plasma damage-free sputtering of an indium tin oxide (ITO) cathode layer, which was grown by a mirror shape target sputtering (MSTS) technique, for use in top-emitting organic light-emitting diodes (TOLEDs). It is shown that OLEDs with ITO cathodes deposited by MSTS show much lower leakage current (9.2×10−5mA∕cm2) at reverse bias of −6V as compared to that (1×10−1–10−2mA∕cm2 at −6V) of OLEDs with ITO cathodes grown by conventional dc magnetron sputtering. Based on high-resolution electron microcopy, x-ray diffraction, and scanning electron microscopy results, we describe a possible mechanism by which plasma damage-free ITO films are grown and their application for TOLEDs.

Thin film transistors (TFTs) with In and Ga-free multicomponent Zn–Sn–Zr–O (ZTZO) channel layers were fabricated using the cosputtering approach. The incorporation of ZrO2 into the Zn–Sn–O (ZTO) films increased the contact resistance, which led to the degradation of the transport properties. In contrast, the threshold voltage shift under negative bias illumination stress (NBIS) was largely improved from −12.5 V (ZTO device) to −4.2 V (ZTZO device). This improvement was attributed to the reduction in the oxygen vacancy defects in the ZTZO film, suggesting that the photoinduced transition from VO to VO2+ was responsible for the NBIS-induced instability.