The lab-on-chip (LOC) platform has presented a powerful opportunity to improve functionalization, parallelization, and miniaturization on planar or multilevel geometries that has not been possible with fiber optic technology. A migration of such LOC devices into the optical fiber platform would therefore open the revolutionary prospect of creating novel lab-in-fiber (LIF) systems on the basis of an efficient optical transport highway for multifunctional sensing. For the LIF, the core optical waveguide inherently offers a facile means to interconnect numerous types of sensing elements along the optical fiber, presenting a radical opportunity for optimizing the packaging and densification of diverse components in convenient geometries beyond that available with conventional LOCs. In this paper, three-dimensional patterning inside the optical fiber by femtosecond laser writing, together with selective chemical etching, is presented as a powerful tool to form refractive index structures such as optical waveguides and gratings as well as to open buried microfluidic channels and optical resonators inside the flexible and robust glass fiber. In this approach, optically smooth surfaces (~12 nm rms) are introduced for the first time inside the fiber cladding that precisely conform to planar nanograting structures when formed by aberration-free focusing with an oil-immersion lens across the cylindrical fiber wall. This process has enabled optofluidic components to be precisely embedded within the fiber to be probed by either the single-mode fiber core waveguide or the laser-formed optical circuits. We establish cladding waveguides, X-couplers, fiber Bragg gratings, microholes, mirrors, optofluidic resonators, and microfluidic reservoirs that define the building blocks for facile interconnection of inline core-waveguide devices with cladding optofluidics. With these components, more advanced, integrated, and multiplexed fiber microsystems are presented demonstrating fluorescence detection, Fabry-Perot interferometric refractometry, and simultaneous sensing of refractive index, temperature, and bending strain. The flexible writing technique and multiplexed sensors described here open powerful prospects to migrate the benefits of LOCs into a more flexible and miniature LIF platform for highly functional and distributed sensing capabilities. The waveguide backbone of the LIF inherently provides an efficient exchange of information, combining sensing data that are attractive in telecom networks, smart catheters for medical procedures, compact sensors for security and defense, shape sensors, and low-cost health care products.
We present a novel multi-level diffractive optical element for diffractive optic near-field lithography based fabrication of large-area diamond-like photonic crystal structure in a single laser exposure step. A multi-level single-surface phase element was laser fabricated on a thin polymer film by two-photon polymerization. A quarter-period phase shift was designed into the phase elements to generate a 3D periodic intensity distribution of double basis diamond-like structure. Finite difference time domain calculation of near-field diffraction patterns and associated isointensity surfaces are corroborated by definitive demonstration of a diamond-like woodpile structure formed inside thick photoresist. A large number of layers provided a strong stopband in the telecom band that matched predictions of numerical band calculation. SEM and spectral observations indicate good structural uniformity over large exposure area that promises 3D photonic crystal devices with high optical quality for a wide range of motif shapes and symmetries. Optical sensing is demonstrated by spectral shifts of the Gamma-Zeta stopband under liquid emersion.
Temperature-compensated 3D fiber shape sensing is demonstrated with femtosecond laser direct-written optical and Bragg grating waveguides that were distributed axially and radially inside a single coreless optical fiber. Efficient light coupling between the laser-written optical circuit elements and a standard single-mode fiber (SMF) was obtained for the first time by 3D laser writing of a 1 × 3 directional coupler to meet with the core waveguide in the fusion-spliced SMF. Simultaneous interrogation of nine Bragg gratings, distributed along three laterally offset waveguides, is presented through a single waveguide port at 1 kHz sampling rate to follow the Bragg wavelength shifts in real-time and thereby infer shape and temperature profile unambiguously along the fiber length. This distributed 3D strain and thermal sensor is freestanding, flexible, compact, lightweight and opens new directions for creating fiber cladding photonic devices for a wide range of applications from shape and thermal sensing to guidance of biomedical catheters and tools in minimally invasive surgery.
A new beam delivery method is introduced for controlling filament formation in optical fiber that enables point-by-point writing of 1 order fiber Bragg gratings (FBGs) with single femtosecond laser pulses. Uniform filament tracks with azimuthal symmetry were formed fully through the 9.3 µm core waveguide by a modified immersion focusing method to eliminate astigmatism by the cylindrical fiber shape. Filament arrays were precisely assembled inside of single-mode fiber, generating strong FBG resonances in the telecommunication band. Laser exposure control within this unique thin-grating geometry were key to manipulating the relative strength of the Bragg and cladding mode resonances while also independently tailoring their spectral resolution and features. This filament-by-filament writing rapidly forms gratings with highly flexible pattern control to tune wavelength, or introduce optical defects, demonstrated by a π-shifted FBG having a sharp 25 pm resonance embedded within a broader Bragg peak.
Great strides have been made over the past decade to establish femtosecond lasers in advanced manufacturing systems for enabling new forms of non-contact processing of transparent materials. Research advances have shown that a myriad of additive and subtractive techniques is now possible for flexible 2D and 3D structuring of such materials with micro- and nano-scale precision. In this paper, these techniques have been refined and scaled up to demonstrate the potential for 3D writing of high-density optical packaging components, specifically addressing the major bottleneck for efficiently connecting optical fibres to silicon photonic (SiP) processors for use in telecom and data centres. An 84-channel fused silica interposer was introduced for high-density edge coupling of multicore fibres (MCFs) to a SiP chip. Femtosecond laser irradiation followed by chemical etching was further harnessed to open alignment sockets, permitting rapid assembly with precise locking of MCF positions for efficient coupling to laser written optical waveguides in the interposer. A 3D waveguide fanout design provided an attractive balancing of low losses, mode-matching, high channel density, compact footprint, and low crosstalk. The 3D additive and subtractive processes thus demonstrated the potential for higher scale integration and rapid photonic assembly and packaging of micro-optic components for telecom interconnects, with possible broader applications in integrated biophotonic chips or micro-displays.
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