We report on an experimental demonstration of graphene-metal ohmic contacts with contact resistance below 100 Ω µm. These have been fabricated on graphene wafers, both with and without hydrogen intercalation, and measured using the transmission line method. Specific contact resistivities of 3 × 10−7 to 1.2 × 10−8 Ω cm2 have been obtained. The ultra-low contact resistance yielded short-channel (source-drain distance of 0.45 µm) HfO2/graphene field effect transistors (FETs) with a low on-resistance (Ron) of 550 Ω µm and a high current density of 1.7 A/mm at a source-drain voltage of 1 V. These values represent state-of-the-art (SOA) performance in graphene-metal contacts and graphene FETs. This ohmic contact resistance is comparable to that of SOA high-speed III–V high electron mobility transistors.
We report deep-submicrometer gate-recessed and field-plated AlGaN-GaN HEMTs and their state-of-the-art continuous wave (CW) power performance measured at 30 GHz. The AlGaN-GaN HEMTs exhibit a CW power density of 5.7 W/mm with a power-added efficiency (PAE) of 45% and drain-efficiency of 58% at ds = 20 V. At ds = 28 V, the output power density is measured as high as 6.9 W/mm with both PAE and output power increasing with input power level. Compared to conventional T-gated AlGaN-GaN HEMTs, the output power density and PAE of gate-recessed AlGaN-GaN HFETs are improved greatly, along with the excellent pulsed IVs. We attribute the improvement to both a field-plating effect and a vertical separation of the gate plane from surface states.Index Terms-Field-effect transistor (FET), GaN, HEMT, millimeter-wave (mmWave).
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