For low‐temperature co‐fired ceramic technology, the fabrication of high‐performance green sheet is a critical step because of its effect on subsequent operations such as punching, printing, laminating, and firing. Here, we present an overview of the tape casting process for manufacturing high‐performance low‐temperature co‐fired ceramic green sheets. Previous research is reviewed, and the primary materials for preparing the casting slurry, such as powders, solvents, dispersants, binders, and plasticizers, are systematically described. Their functions, application methods, and action mechanisms are described. Suggestions are made for future research into the tape casting process based on recent results.

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Spin-coated low-k dielectrics are now widely used in integrated circuit processing due to their low permittivity and planarization properties. Another area of potential application is in large area digital imaging using amorphous silicon (a-Si:H) technology where low-k dielectrics enable new integration schemes for thin film transistors (TFT) and sensors. In this work, the properties of spin-coated, polymeric, low-k dielectric materials, BCB (benzocyclobutene) and HSQ (hydrogen silsesquioxane), are studied after treating them with low temperature anneals. Fourier transform infrared spectroscopy (FTIR), high frequency capacitance–voltage, topographic planarization, and wafer deflection stress measurements have been used to characterize the films so as to correlate with processing conditions. Lower k values are obtained for lower process temperatures and are correlated by capacitance and FTIR measurements. Annealing in the presence of O2 appears to increase the permittivity. The BCB films yield low stress and good (>90%) planarization and are suitable as interlevel dielectrics in the vertical integration of a-Si TFT and sensor arrays.

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