This paper describes the new Cameca Akonis secondary ion mass spectrometry (SIMS) tool, which was developed to fill a critical gap in semiconductor fabrication processes by providing high throughput, high precision detection for implant profiles, composition analysis, and interfacial data directly in the semiconductor manufacturing line. The system enables automation in the primary ion column to ensure repeatability across tools for fabrication-level process control and tool-to-tool matching.
This work explores quantitative boron depth profiling in the top first nanometer using dynamic secondary ion mass spectrometry (SIMS). Dynamic SIMS measurements were performed with a magnetic sector CAMECA IMS Wf/SC Ultra, using extremely low impact energy O2+ (below 250 eV) sputtering. It was concluded that the modification of quantification protocol by the creation of a surface transient curve can provide a tool for the accurate characterization of low energy implantation wafers, including boron, under extremely low energy sputtering conditions with an oxygen beam.
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