Zinc-air batteries are considered promising energy storage devices for future energy applications due to their high energy density, safety, and low cost. However, poor battery performance and low efficiency of zinc utilization, resulted from passivation effect of the zinc anode, is a major challenge. Thus, in this work, investigation of electronic and ionic conductivities enhancement of the zinc anode for flexible printed zinc-air batteries has been carried out. The anode was made from zinc-based inks, prepared from a mixture of zinc and zinc oxide particles. Carbon black, sodium silicate (Na2SiO3) and bismuth oxide (Bi2O3) were investigated for implementation on the anode. The results showed that performance of the batteries increased when carbon black was introduced into the anode as the presence of carbon black improved electronic conductivity of the anode. Again, the batteries performed better when Bi2O3 or Na2SiO3 was introduced due to the formation of solid electrolyte interface(SEI) on the anode. The SEI inhibits passivation of zinc active surfaces and provides effective electrolyte access. The batteries with Bi2O3 provided the best performance. The highest performance was observed when Bi2O3 content reached 26 wt.%. No significant improvement was observed when Bi2O3 concentration increased higher than 26 wt.%.
A simple and low-cost method to fabricate copper conductive patterns at low temperature is critical for printed electronics. Low-temperature spray-pyrolysis of copper-alkanolamine complex solution shows high potential for this application. However, the produced copper patterns exhibit a granular structure consisting of connected fine copper particles. In this work, low-temperature spray-pyrolysis of copper formate-diethanolamine complex solution under N2 flow at a temperature of 200 °C was investigated. The effects of spraying conditions on microstructure and electrical properties of the patterns were examined. Our results revealed that the spraying rate is a critical parameter determining the degree of sintering and electrical resistivity of the patterns. A low spraying rate facilitates sintering, and hence well-sintered copper patterns with the lowest resistivity of 6.12 μΩ.cm (3.6 times of bulk copper) on a polyimide substrate could be fabricated.
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