A compact, electrically driven light source integrated on silicon is a key component for large-scale integration of electronic and photonic integrated circuits. Here we demonstrate electrically injected continuouswave lasing in InP-based microdisk lasers coupled to a sub-micron silicon wire waveguide, fabricated through heterogeneous integration of InP on silicon-on-insulator (SOI). The InP-based microdisk has a diameter of 7.5 μm and a thickness of 1 μm. A tunnel junction was incorporated to efficiently contact the p-side of the pn-junction. The laser emits at 1.6 μm, with a threshold current as low as 0.5 mA under continuous-wave operation at room temperature, and a threshold voltage of 1.65 V. The SOI-coupled laser slope efficiency was estimated to be 30 μW/mA, with a maximum unidirectional output power of 10 μW.

Abstract-We demonstrate single-mode photonic wires in Silicon-on-insulator with propagation loss as low as 2.4 dB/cm, fabricated with deep ultraviolet lithography and dry etching. We have also made compact racetrack and ring resonators functioning as add-drop filters, attaining values larger than 3000 and low add-drop crosstalk.Index Terms-High index contrast, photonic wire, ring resonators, Silicon-on-insulator (SOI) technology.

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These authors contributed equally to this work.Fully exploiting the silicon photonics platform requires a fundamentally new approach to realize high-performance laser sources that can be integrated directly using wafer-scale fabrication methods. Direct band gap III-V semiconductors allow efficient light generation but the large mismatch in lattice constant, thermal expansion and crystal polarity makes their epitaxial growth directly on silicon extremely complex. Here, using a selective area growth technique in confined regions, we surpass this fundamental limit and demonstrate an optically pumped InP-based distributed feedback (DFB) laser array grown on (001)-Silicon operating at room temperature and suitable for wavelength-division-multiplexing applications. The novel epitaxial technology suppresses threading dislocations and anti-phase boundaries to a less than 20nm thick layer not affecting the device performance. Using an in-plane laser cavity defined by standard top-down lithographic patterning together with a high yield and high uniformity provides scalability and a straightforward path towards cost-effective cointegration with photonic circuits and III-V FINFET logic.The potential of leveraging well-established and high yield manufacturing processes developed initially by the electronics industry has been the main driver fueling the massive research in silicon photonics over 2 the last decade [1][2][3][4][5][6] . From the start of its development though the lack of efficient optical amplifiers and laser sources monolithically integrated with the silicon platform inhibited the widespread adoption in high-volume applications. Solutions relying on flip-chipping prefabricated laser diodes 7,8 or bonding III-V epitaxial material [9][10][11] are now being deployed in commercially available optical interconnects but are less compatible with standard high-volume and low cost manufacturing processes. Approaches focusing on the engineering of group IV materials have achieved optical gain but still require extensive work to reach room temperature lasing at reasonable efficiency [12][13][14] . Therefore, the monolithic integration of direct bandgap III-V semiconductors, well known to be efficient light emitters, with the silicon photonics platform is heavily investigated. However, considerable hurdles need to be overcome. When directly growing III-V semiconductors on silicon substrates, the large lattice mismatch (εInP/Si = 8.06 %), the difference in thermal expansion and the different polarity of the materials result in large densities of crystalline defects including misfit and threading dislocations, twins, stacking faults and anti-phase boundaries, strongly degrading the performance and reducing the lifetime of any device fabricated in the as-grown layers 15 . Several routes to overcome these issues have been proposed. GaP-related materials can be grown on exact (001) silicon substrates with a small lattice mismatch and pulsed laser oscillation around 980 nm up to 120 K 16 has been achieved but shifting the laser...

High performance integrated optical modulators are highly desired for future optical interconnects. The ultra-high bandwidth and broadband operation potentially offered by graphene based electro-absorption modulators has attracted a lot of attention in the photonics community recently. In this work, we theoretically evaluate the true potential of such modulators and illustrate this with experimental results for a silicon integrated graphene optical electro-absorption modulator capable of broadband 10 Gb/s modulation speed. The measured results agree very well with theoretical predictions. A low insertion loss of 3.8 dB at 1580 nm and a low drive voltage of 2.5 V combined with broadband and athermal operation were obtained for a 50 µm-length hybrid graphene-Si device. The peak modulation efficiency of the device is 1.5 dB/V. This robust device is challenging best-in-class Si (Ge) modulators for future chip-level optical interconnects.