No abstract

No abstract

Rapid thermal processing (RTP) has been considered from a manufacturing point of view as a potential technology for depositing thin films by low-pressure chemical vapor deposition (LPCVD) in a single wafer manufacturing environment in this work. The results of this study suggest that new chemical processes must be developed to satisfy the throughput requirements of single wafer manufacturing and the demands of cold-wall reactor design. Issues such as temperature measurement and uniformity are reviewed and reconsidered in the context of LPCVD. New tool requirements for reduced pressure operation are discussed. New advances in tool design are needed (especially in temperature measurement) before rapid thermal chemical vapor deposition (RTCVD) can be considered as a routine manufacturable process.

No abstract

No abstract