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Background: The accuracy of the remote dielectric sensing (ReDSTM) system, which is a noninvasive electromagnetic-based technology to quantify lung fluid levels, particularly among those with small body size, remains uncertain. Methods: Hospitalized patients with and without heart failure underwent assessment of lung fluid levels with ReDS and successive chest computed tomography imaging. We performed a correlation analysis of the ReDS measurement, representing lung fluid levels, and computed tomography-derived high attenuation area percentage, which also provides a spatial quantification of lung fluid level. Results: A total of 46 patients (median 76 years old, 28 men), including 28 patients with heart failure, were included. The median ReDS value was 28% (interquartile: 23%, 33%), and the median percentage of high attenuation area was 21.6% (14.4%, 28.5%). ReDS values and percentage of high attenuation area were moderately correlated (r = 0.65, p < 0.001), irrespective of the existence of heart failure. ReDS value independently predicted the percentage of high attenuation area seen on computed tomography (p < 0.001). Conclusions: The ReDS system may be a promising, noninvasive tool to quantify fluid lung levels, as validated by comparison with chest computed tomography imaging. Further studies are warranted to validate the utility and applicability of this technology to a variety of clinical scenarios.

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Articles you may be interested inHighly (002) textured large grain bcc Cr80Mn20 seed layer on Cr50Ti50 amorphous layer for FePt-C granular filmThe influence of the growth rate on the preferred orientation of magnetron-sputtered Ti-Al-N thin films studied by in situ x-ray diffraction J. Appl. Phys. 98, 044901 (2005); 10. 1063/1.1999829 Interfacial mechanism studies of electroless plated Cu films on a -Ta:N layers catalyzed by PIIIThe effect of underlayer texture on Cu film orientation has been studied. Cu texture correlates well with the underlayer texture. The Cu͗111͘ crystallographic orientation is enhanced on TiN film with a strong TiN͗111͘ orientation. Cu preferred orientation can be controlled by choosing an appropriate underlayer. Cross-sectional transmission electron microscope observation revealed that the Cu͑111͒ plane grows epitaxially on the TiN͑111͒ plane in spite of the large lattice mismatch between Cu and TiN. The atomic arrangement between Cu͑111͒ and TiN͑111͒ planes in TiN film deposited on Cu film has a rotational angle within Ϯ10°around the ͗111͘ axis. On the other hand, in Cu film deposited on TiN film, there are two rotational angles: a rotational angle of 25°-30°in large Cu grain region and little rotation with rotational angle distributions less than 10°in a small Cu grain region. These results can be explained by consideration of superlattice mismatch. Cu͑111͒ plane rotation occurs so as to have more energy stable position at coalescence stage.

The COVID-19 crisis has had a great impact on Japanese society. The author is rapidly going online and trying to make the transition to a new way of life. This study discusses the topics before and after the COVID-19 pandemic in Japan. Then, smart approaches to waste management for post-COVID-19 smart cities in Japan are described by illustrating the results of the author's research group. Specifically, the author states that virtual reality can be an effective solution for remote education. The work chain management system contributes to the promotion of cashless in addition to the traceability of waste. The multi-benefits mobility system that supports self-driving will contribute to the automatic garbage collection by linking it to smart garbage bins. Besides, remote control of waste incineration facilities and robotic arms in waste treatment and recycling facilities will take on more importance. The author believes that the COVID-19 crisis could be an opportunity to accelerate smart city initiatives in Japan.

As the automotive industry shifts from internal combustion engine (ICE) vehicles to electric vehicles (EVs), many countries are setting new strategies in their transportation sector. The Li-ion battery is currently the most common battery used in EVs due to its high energy density, durability, safety, and cost competitiveness. Nickel is predicted to be an essential component for the lithium nickel cobalt manganese oxide (NMC) as a cathode material of choice for EV applications. Indonesia, one of the world’s largest nickel ore suppliers, put an export ban on nickel ore effective from 2020. The bold movement was intended to initiate the domestic EV industry and encourage investors abroad to drive their manufacturing activities into the country. On the other hand, the global Li-ion battery manufacturers who imported nickel from Indonesia had to restrategize their businesses. This review discussed the chronological events leading to the ban and after the ban from the media, government regulations, and literature reviews. The authors of this study also conducted interviews and attended seminars with the national experts and key players in the battery and EV industry to gain their most pertinent insights. The SWOT analysis of the reviewed materials indicated that while the Indonesian battery industry is still new, it needs to diversify its research and development activities and collaborate internationally to optimize the utilization of its resources and meet the purchasing power of the domestic EV market. Finally, this study summarized six key factors to support Indonesia’s ambition to be a new regional hub for EVs. These factors are: (1) pricing, (2) technology, (3) policy, (4) investment, (5) infrastructure, and (6) compliance with sustainability standards.

Background: Remote dielectric sensing (ReDS™) is an electromagnetic-based technology used to noninvasively measure lung fluid levels. The association between ReDS values and invasively measured hemodynamics, particularly among those with small physics, remains unknown. Methods: Consecutive patients with chronic heart failure who were admitted to our institute and underwent invasive right heart catheterization as well as simultaneous ReDS measurement at clinically stable conditions between September and November 2021 were prospectively included. The colinearity between ReDS values and pulmonary capillary wedge pressure was studied. Results: In total, 30 patients (median 79 (73, 84) years old, 13 men) were included. Median ReDS value was 26% (22%, 28%). ReDS values had a moderate collinearity with pulmonary capillary wedge pressure (r = 0.698, p < 0.001), even among those with a body height <155 cm. ReDS values with a cutoff of 28% predicted a pulmonary capillary wedge pressure >15 mmHg with sensitivity 0.70 and specificity 0.75. Conclusions: An electromagnetic-based engineering ReDS might be a potential tool to estimate cardiac pressure in patients with heart failure, including those with small physics.

Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect treesIn situ electron microscopy studies of electromigration in stacked Al(Cu)/TiN interconnects Appl.We investigated the effects of Ti insertion between Cu and TiN layers on electromigration ͑EM͒ in Cu/Ti/TiN/Ti layered damascene interconnects. The Cu damascene interconnects with Ti insertion show an EM lifetime of up to 100 times longer than those without Ti insertion, depending on the inserted Ti thickness. The lifetime improves as Ti thickness increases from 10 to 20 nm. Ti insertion increased the sheet resistance of the layered film after annealing and enhanced the adhesion of Cu to underlayer TiN. The resistance change was mainly caused by formation of Cu-Ti reaction products resulting in reduced cross-sectional area in the Cu film, and was also caused by Ti incorporation into the Cu film. Ti insertion, however, does not have any effect on Cu film microstructure such as median grain size, standard deviation of grain size distribution, and texture. During EM testing, the resistance in Cu interconnects with Ti insertion initially decreases, then rises gradually, and finally increases rapidly until failure occurs. This behavior is probably caused by Ti redistribution in Cu during the EM testing. EM lifetime consists mainly of the time when the interconnect resistance is lower than the initial resistance, that is, the time before void growth occurs ͑incubation time͒. Improved Cu adhesion to underlayer TiN is an important factor because the void growth rate of Cu interconnects during EM testing is considerably decreased by Ti insertion. The void growth rate, however, does not depend on Ti thickness and Ti surface treatment before Cu deposition. As a result, EM lifetime is mainly governed by the incubation time, and the void growth rate is determined by Cu EM through the Cu/barrier interface path.