In this study, acrylonitrile butadiene rubber (NBR)–gelatin blends were prepared by conventional melt blending process at 40°C processing temperature and 50 r min−1 rotor speed in a Brabender-Plasticorder. Gelatin loading was varied from 10 to 50 phr. The extent of reinforcement was more prominent at 30 phr gelatin loading without compatibilization. Up to 30 phr gelatin loading, the tensile strength, abrasion resistance, and morphological properties of blends increased. After 30 phr gelatin loading, the toughness and abrasion resistance declined for samples containing 40 and 50 phr gelatin. However, cross-link density and hardness kept on increasing beyond 30 phr loading. At optimum loading of 30 phr of gelatin, 3, 3.5, and 4 phr of nano-silanized silica was added as a compatibilizer for further improvement in properties. After compatibilization of 30 phr gelatin sample with 4 phr of nano-silanized silica, the extent of reinforcement in terms of tensile strength was improved from 8.97 to 9.92 MPa.
In current study polyaniline filled polypropylene (PP/PAni) conductive composites were prepared by a novel premixing technique followed by melt mixing. The PP/PAni composites were also compatibilized by addition of polypropylene grafted maleic anhydride. Polyaniline was prepared by using ammonium per sulphate and ferric chloride as single oxidants. Effects of oxidizing agents (of polyaniline) on composites were studied by morphological, electrical and mechanical properties on composites. FTIR analysis was also carried out to study the nature of interactions and possible bonding between polyaniline and polypropylene matrix. Thermal analysis was carried out to study the thermal stability of composites. Morphological analysis revealed that the proposed premixing technique was quite successful in depositing polyaniline to polypropylene matrix. This analysis was also supported by the results of electrical conductivity where formation of conductive pathways were observed by addition of polyaniline thus converting insulating nature of polypropylene to a semiconducting one.
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