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Band-gap engineering using SiGe channels to reduce the threshold voltage (V TH ) in p-channel MOSFETs has enabled a simplified gate-first high-κ/metal gate (HKMG) CMOS integration flow. Integrating Silicon-Germanium channels (cSiGe) on silicon wafers for SOC applications has unique challenges like the oxidation rate differential with silicon, defectivity and interface state density in the unoptimized state, and concerns with T inv scalability. In overcoming these challenges, we show that we can leverage the superior mobility, low threshold voltage and NBTI of cSiGe channels in high-performance (HP) and low power (LP) HKMG CMOS logic MOSFETs with multiple oxides utilizing dual channels for nFET and pFET.Introduction:

In this paper, we present a cost-effective 28nm CMOS technology for low power (LP) applications based on a high-k, single-metal-gate-first architecture. We report raw gate densities up to 4200 kGate/mm 2 , and, using the ARM Cortex-R4F as a reference, we report achievement of an overall 2.4x area reduction in 28nm from 45nm technology. Our high-density SRAM bit-cell (area= 0.120mm 2 ) has a demonstrated Static Noise Margin (SNM) of 213mV at 1V. Fully compatible with power/leakage management techniques intensively used in low power designs, the transistor drive currents are increased +35% & +10%, for nFET and pFET respectively, with respect to a 28nm LP poly/SiON reference [3]. Compatible with LP system-on-chip requirements, ultra low-cost, high performance analog devices are reported which leverage a dramatic improvement in matching factor (AVT~2mV.um) versus our previously-reported result [2]. An optimized interconnection scheme based on Extreme Low k (ELK) dielectric (k~2.4) and advanced metallization allows high density wiring with competitive R-C versus our previous technology.

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