The Functional Mockup Interface (FMI) is a tool independent standard for the exchange of dynamic models and for co-simulation. The development of FMI was initiated and organized by Daimler AG within the ITEA2 project MODELISAR. The primary goal is to support the exchange of simulation models between suppliers and OEMs even if a large variety of different tools are used. The FMI was developed in a close collaboration between simulation tool vendors and research institutes. In this article an overview about FMI is given and technical details about the solution are discussed.
The Functional Mockup Interface (FMI) is a tool independent standard for the exchange of dynamic models and for Co-Simulation. The first version, FMI 1.0, was published in 2010. Already more than 30 tools support FMI 1.0. In this paper an overview about the upcoming version 2.0 of FMI is given that combines the formerly separated interfaces for Model Exchange and Co-Simulation in one standard. Based on the experience on using FMI 1.0, many small details have been improved and new features introduced to ease the use and increase the performance especially for larger models. Additionally, a free FMI compliance checker is available and FMI models from different tools are made available on the web to simplify testing.
Co-Simulation is a general approach to simulate coupled technical systems. In a master-slave concept the slaves simulate sub-problems whereas the master is responsible for both coordinating the overall simulation as well as transferring data. To unify the interface between master and slave the FMI for Co-Simulation was developed. Using FMI a master was implemented with simple and advanced algorithms which can be applied depending on the properties of the involved slave simulators. The master was tested amongst others by coupling with SimulationX.
Complex multi-disciplinary models in system dynamics are typically composed of subsystems. This modular structure of the model reflects the modular structure of complex engineering systems. In industrial applications, the individual subsystems are often modeled separately in different mono-disciplinary simulation tools. The Functional Mock-Up Interface (FMI) provides an interface standard for coupling physical models from different domains and addresses problems like export and import of model components in industrial simulation tools (FMI for Model Exchange) and the standardization of co-simulation interfaces in nonlinear system dynamics (FMI for Co-Simulation), see [8]. In November 2011, the third β -version of FMI for Model Exchange and Co-Simulation v2.0 was released [13] that supports advanced numerical techniques in co-simulation like higher order extrapolation and interpolation of subsystem inputs, step size control including step rejection and Jacobian based linearly implicit stabilization techniques. Well known industrial simulation tools for applied dynamics support Version 1.0 of this standard and plan to support the forthcoming Version 2.0 in the near future, see the "Tools" tab of website [8] for up-to-date information. The renewed interest in algorithmic and numerical aspects of co-simulation inspired some new investigations on error estimation and stabilization techniques in FMI for Model Exchange and Co-Simulation v2.0 compatible co-simulation environments. The present paper extends recent results from [3] on reliable error estimation and communication step size control in the framework of FMI for Model Exchange and Co-Simulation v2.0. Based on a strict mathematical analysis, we study the asymptotic behaviour of the local error and two error estimates that may be used to adapt the communication step size automatically to the changing solution behaviour during time integration. These theoretical results are illustrated by numerical tests for a (linear) quarter car model and provide a basis for future investigations with more complex coupled engineering systems.
The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator. In difference to other known simulator couplings a time step algorithm is used. Its implementation into simulation tools is described. The thermal modeling of the die/package structure and the extended modeling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results
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