Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.
This paper seeks to understand and design next-generation servers for emerging "warehouse-computing" environments. We make two key contributions. First, we put together a detailed evaluation infrastructure including a new benchmark suite for warehouse-computing workloads, and detailed performance, cost, and power models, to quantitatively characterize bottlenecks. Second, we study a new solution that incorporates volume non-server-class components in novel packaging solutions, with memory sharing and flash-based disk caching. Our results show that this approach has promise, with a 2X improvement on average in performance-per-dollar for our benchmark suite.
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