Atomically thin two-dimensional (2D) metals may be key ingredients in next-generation quantum and optoelectronic devices. However, 2D metals must be stabilized against environmental degradation and integrated into heterostructure devices at the wafer scale. The high-energy interface between silicon carbide and epitaxial graphene provides an intriguing framework for stabilizing a diverse range of 2D metals. Here we demonstrate large-area, environmentally stable, epitaxial graphene/single-crystal 2D gallium, indium, and tin heterostructures. The 2D metals are covalently bonded to SiC below but present a non-bonded interface to graphene overlayer, i.e. they are "half van der Waals" metals with strong internal gradients in bonding character. These non-centrosymmetric 2D metals open compelling opportunities for superconducting devices, topological phenomena, and advanced optoelectronic properties. For example, the reported 2D-Ga is a superconductor that combines six strongly coupled Ga-derived electron pockets with a large nearly-freeelectron Fermi surface that closely approaches the Dirac points of the graphene overlayer.Major advances in fundamental science have followed from the exfoliation, stacking, and encapsulation of atomically thin 2D layers 1 . The next step towards technological impact of 2D layers and heterostructures is to transition sophisticated "pick and place" devices to a wafer-scale platform. However, the sensitivity of 2D systems to interfacial reactions and environmental influences -especially for two-dimensional metals or small-gap semiconductors -poses challenges for large-scale integration. Very few metals resist degradation of their top few atomic layers upon environmental exposure, and for a 2D metal, these layers constitute the entire system. A general platform for producing environmentally stable and wafer-scale 2D metals that are not prone to interfacial interactions would represent a significant advance. Inspired by the success of wide-bandgap 2D gallium nitride 2 , we turn focus onto the metal alone and demonstrate a platform dubbed confinement heteroepitaxy (CHet), where the interface between epitaxial graphene (EG) and silicon carbide (SiC) stabilizes crystalline 2D forms of Group-III (Ga, In) and group-IV (Sn) elements. Defect engineering of the graphene overlayer enables uniform, large-area intercalation at the high-energy SiC/EG interface; this interface then templates intercalant crystallization at a thermodynamically defined number of atomic layers. The unreactive nature of as-grown EG on SiC (graphene plus buffer layer) performs multiple services: (1) it only partially passivates the SiC surface underneath, thereby sustaining the high-energy interface that drives intercalation; (2) it lowers the energy of the (otherwise exposed) upper surface of the metal, thus facilitating 2D morphologies; (3) it protects the newly formed 2D metal from environmental degradation after intercalation through in situ healing of the graphene defects. Stability of these 2D metals in air over months gr...

Atomically thin transition metal dichalcogenides (TMDs) are of interest for next-generation electronics and optoelectronics. Here, we demonstrate device-ready synthetic tungsten diselenide (WSe) via metal-organic chemical vapor deposition and provide key insights into the phenomena that control the properties of large-area, epitaxial TMDs. When epitaxy is achieved, the sapphire surface reconstructs, leading to strong 2D/3D (i.e., TMD/substrate) interactions that impact carrier transport. Furthermore, we demonstrate that substrate step edges are a major source of carrier doping and scattering. Even with 2D/3D coupling, transistors utilizing transfer-free epitaxial WSe/sapphire exhibit ambipolar behavior with excellent on/off ratios (∼10), high current density (1-10 μA·μm), and good field-effect transistor mobility (∼30 cm·V·s) at room temperature. This work establishes that realization of electronic-grade epitaxial TMDs must consider the impact of the TMD precursors, substrate, and the 2D/3D interface as leading factors in electronic performance.

Tungsten ditelluride (WTe2) is a transition metal dichalcogenide (TMD) with physical and electronic properties that make it attractive for a variety of electronic applications. Although WTe2 has been studied for decades, its structure and electronic properties have only recently been correctly described. We experimentally and theoretically investigate the structure, dynamics and electronic properties of WTe2, and verify that WTe2 has its minimum energy configuration in a distorted 1T structure (Td structure), which results in metallic-like transport. Our findings unambiguously confirm the metallic nature of WTe2, introduce new information about the Raman modes of Td-WTe2, and demonstrate that Td-WTe2 is readily oxidized via environmental exposure. Finally, these findings confirm that, in its thermodynamically favored Td form, the utilization of WTe2 in electronic device architectures such as field effect transistors may need to be reevaluated.