Original scientific paper https://doi.org/10.2298/TSCI180722022AWater cooled heat sinks are becoming popular due to increased heat generation inside the microprocessor. Timely heat removal from microprocessor is the key factor for better performance and long life. Heat transfer enhancement is reached either by increasing the surface area density and/or by altering the base fluid properties. Nanoparticles emerge as a strong candidate to increase the thermal conductivity of base fluids. In this research, the thermal performance of mini-channel heat sinks for different fin spacing (0.2 mm, 0.5 mm, 1 mm, and 1.5 mm) was investigated numerically using CuO-water nanofluids with volumetric concentration of 1.5%. The numerical values computed were than compared with the literature and a close agreement is achieved. We recorded the minimum base temperature of chip to be 36.8 °C for 0.2 mm fin spacing heat sink. A reduction of 9.1% in base temperature was noticed using CuO-water nanofluids for 0.2 mm fin spacing as compared to previously experimental estimated value using water [1]. The drop percentage difference in pressure between water and CuO-water nanofluids was 2.2-13.1% for various fin spacing heat sinks. The percentage difference in thermal resistance between water and CuO-water nanofluids was computed 12.1% at maximum flow rate. We also observed uniform temperature distribution for all heat sinks.
Thermal performance of micro-hole cellular structure using water as a cooling fluid was investigated through CFD and then numerical results were validated with the experimental results. The minimum base temperature for the micro-hole cellular structure was found to be 29.7 °C and 32.3 °C numerically and experimentally, respectively, with volumetric flow rate of 0.000034 m 3 /s (2 Lpm) at a heating power of 345 W. Numerical values of the base temperature are in close agreement with experimental results with an error of 8.75%. Previously, the base temperatures of heat sinks using alumina nanofluid with 1% of volumetric concentration and water with volumetric flow rate of 0.000017 m 3 /s (1 Lpm) have been reported to be 43.9 °C and 40.5 °C, respectively.
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