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Microelectronics and, chiefly, silicon integrated circuit microelectronics, has created astonishing capabilities over the last 40 years. Speedy advancement in CMOS transistor equipment leading to the gigahertz speeds common today has necessitated chief changes in semiconductor manufacturing technology and the expansion of high frequency compatible packaging. The progress of an optimized formulation for electroless nickel (EN) plating with a long life span to make a deposit with good corrosion resistance (CR). The electroless deposition of NiP alloys is widely used in diverse fields such as aerospace, automation, electronics, nuclear, oil and gas production, and valve industries. Lead frame is the primary package metallurgical bond pad interface in microelectronic devices which provides external interconnection. The most predominant lead frame material is copper with tin plating. Over the years, galvanic corrosion and copper oxidation are two major reliability concerns for any microelectronics packages with copper lead frame, when operating under high humidity environment.